Effect of Additives and Substrate Resistance on Shape Evolution During Electrodeposition: Nucleation, Growth and Trench Infill for Copper Interconnects

Cu nucleation and growth on resistive thin gold and ruthenium films was carried out in a electrochemical cell. A current pulse technique was found to produce a higher nucleation density that served to reduce the terminal effect and to result in more uniform deposit thickness and coalesce more rapid across the entire resistive strip. The best results were obtained with high PEG/C1- and low SPS concentration, and with a current pulse regime of 40 mA/cm2 for 0.1 s and -0.0006 A for 1 s. The current pulse technique could also produce denser nuclei number at the location near the far end of Ru films than the steady galvanostatic deposition.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Chemical and Biomolecular Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2015

Author dc:creator

• Qin, Yan

Contributors dc:contributor

• Alkire, Richard C.

• Engineering, Chemical

Language dc:language

eng

Identifier

(MiAaPQ)AAI3242968

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/82385