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University of Illinois - Urbana-Champaign

Low Cycle Fatigue and Crack Growth in Oxygen Free High Conductivity Copper

Abstract

dc:description

Made available in DSpace on 2017-07-06T18:48:49Z (GMT). No. of bitstreams: 3 Jelke_Brian_E_MS.pdf: 38403107 bytes, checksum: 6cb6ee777abb55ea1ff6b87f689784be (MD5) Jelke_Brian_E_MS_ABS.pdf: 481228 bytes, checksum: 47c7459288ca83db0d207cd9a08d1c78 (MD5) license.txt: 4813 bytes, checksum: 715c4321821a960fa1a1e91d2ac7ebce (MD5) Previous issue date: 1991

Degree

thesis:*
Name thesis:degree_name
M.S. (master's)
Level thesis:degree_level
Thesis
Discipline thesis:degree_discipline
Nuclear, Plasma, and Radiological Engineering
Year dc:date
2017

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Jelke, Brian E.

Subjects

dc:subject × 8

Rights

dc:rights
Statement dc:rights
  • Copyright 2006 Michael Andrew Jaworski
Language dc:language
en

Identifiers

dc:identifier.*
Handle dc:identifier
http://hdl.handle.net/2142/96394
OAI identifier oai:identifier
oai:www.ideals.illinois.edu:2142/96394

Chain of custody

source
Harvested from
University of Illinois - Urbana-Champaign
Base URL
www.ideals.illinois.edu/oai-pmh
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Jelke, Brian E.. Low Cycle Fatigue and Crack Growth in Oxygen Free High Conductivity Copper. Thesis thesis, 2017. http://hdl.handle.net/2142/96394