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Showing 1 to 2 of 2 for “"Ru films"”.

  1. Growth and characterization of Ru films deposited by chemical vapor deposition : towards enhanced nucleation and film properties

    … need to deposit ultra-thin, smooth, continuous films for use in applications such as the liner in back end processing. The liner must have good adhesion to both Cu and the dielectric, act as a Cu diffusion barrier, and be conductive enough to allow the electroplating of Cu. Ruthenium (Ru) has …

    texas Repository record for Growth and characterization of Ru films deposited by chemical vapor deposition : towards enhanced nucleation and film properties (opens in a new tab)

  2. Effect of Additives and Substrate Resistance on Shape Evolution During Electrodeposition: Nucleation, Growth and Trench Infill for Copper Interconnects

    … nucleation and growth on resistive thin gold and ruthenium films was carried out in a electrochemical cell. A current pulse technique was found to produce a higher nucleation density that served to reduce the terminal effect and to result in more uniform deposit thickness and coalesce more rapid …

    uiuc Repository record for Effect of Additives and Substrate Resistance on Shape Evolution During Electrodeposition: Nucleation, Growth and Trench Infill for Copper Interconnects (opens in a new tab)