Numerical Modeling of Multi-Conductor Interconnects for High Speed Integrated Circuits

Presented here is an alternative methodology to the development of transmission line models for multi-conductor interconnects in high speed integrated circuits. The methodology starts with the assumption that per unit length (p.u.l.) transmission line parameters — i.e. p.u.l. resistance R, inductance L, capacitance C, and conductance G — have been extracted using a two-dimensional RLCG extractor. The methodology relies upon a rational fitting algorithm called VECTFIT to express the parameters as a rational function expression, a form suitable for equivalent circuit generation using a commercial circuit simulator like HSPICE. The methodology has been numerically verified and implemented in the form of some select interconnecting scenarios for typical on-chip applications. The new methodology has also been compared with the previous methodology for robustness, accuracy and computational efficacy.

Name thesis:degree_name

M.S.

Level thesis:degree_level

Thesis

Discipline thesis:degree_discipline

Electrical & Computer Engr

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2011

Author dc:creator

• Sheikh, Zuhaib B.

Contributors dc:contributor

• Cangellaris, Andreas C.

• Transmission Line Model
• Multi-conductor Interconnects
• Two-dimensional RLCG extractor
• Rational Fitting Algorithm
• VECTFIT
• HSPICE

Statement dc:rights

• Copyright 2010 Zuhaib B. Sheikh

Language dc:language

en

Handle dc:identifier

http://hdl.handle.net/2142/18390

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/18390