{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/18390"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/18390","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Numerical Modeling of Multi-Conductor Interconnects for High Speed Integrated Circuits","abstract":"Presented here is an alternative methodology to the development of transmission line models for multi-conductor interconnects in high speed integrated circuits. The methodology starts with the assumption that per unit length (p.u.l.) transmission line parameters — i.e. p.u.l. resistance R, inductance L, capacitance C, and conductance G — have been extracted using a two-dimensional RLCG extractor. The methodology relies upon a rational fitting algorithm called VECTFIT to express the parameters as a rational function expression, a form suitable for equivalent circuit generation using a commercial circuit simulator like HSPICE. The methodology has been numerically verified and implemented in the form of some select interconnecting scenarios for typical on-chip applications. The new methodology has also been compared with the previous methodology for robustness, accuracy and computational efficacy.","abstract_html":"Presented here is an alternative methodology to the development of transmission line models for multi-conductor interconnects in high speed integrated circuits. The methodology starts with the assumption that per unit length (p.u.l.) transmission line parameters — i.e. p.u.l. resistance R, inductance L, capacitance C, and conductance G — have been extracted using a two-dimensional RLCG extractor. The methodology relies upon a rational fitting algorithm called VECTFIT to express the parameters as a rational function expression, a form suitable for equivalent circuit generation using a commercial circuit simulator like HSPICE. The methodology has been numerically verified and implemented in the form of some select interconnecting scenarios for typical on-chip applications. The new methodology has also been compared with the previous methodology for robustness, accuracy and computational efficacy.","abstract_has_math":false,"creators":["Sheikh, Zuhaib B."],"institution":"University of Illinois at Urbana-Champaign","degree_name":"M.S.","degree_level":"Thesis","degree_discipline":"Electrical & Computer Engr","degree_department":null,"school":null,"contributors":["Cangellaris, Andreas C."],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2011,"date_issued":"2011-01-14T22:48:52Z","date_published":"2011-01-14T22:48:52Z","updated_at":"2026-07-22T22:25:11Z","subjects":["Transmission Line Model","Multi-conductor Interconnects","Two-dimensional RLCG extractor","Rational Fitting Algorithm","VECTFIT","HSPICE"],"languages":["en"],"rights":["Copyright 2010 Zuhaib B. Sheikh"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/2142/18390","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Cangellaris, Andreas C."]},{"key":"dc:creator","label":"Author","values":["Sheikh, Zuhaib B."]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2011-01-14T22:48:52Z","2010-12"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Electrical & Computer Engr"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Thesis"]},{"key":"thesis:degree_name","label":"Degree Name","values":["M.S."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Transmission Line Model","Multi-conductor Interconnects","Two-dimensional RLCG extractor","Rational Fitting Algorithm","VECTFIT","HSPICE"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2010 Zuhaib B. Sheikh"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/18390"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Presented here is an alternative methodology to the development of transmission line models for multi-conductor interconnects in high speed integrated circuits. The methodology starts with the assumption that per unit length (p.u.l.) transmission line parameters — i.e. p.u.l. resistance R, inductance L, capacitance C, and conductance G — have been extracted using a two-dimensional RLCG extractor. The methodology relies upon a rational fitting algorithm called VECTFIT to express the parameters as a rational function expression, a form suitable for equivalent circuit generation using a commercial circuit simulator like HSPICE. The methodology has been numerically verified and implemented in the form of some select interconnecting scenarios for typical on-chip applications. The new methodology has also been compared with the previous methodology for robustness, accuracy and computational efficacy.","Item withdrawn by Alexis Thompson (athmpsn1@illinois.edu) on 2010-12-02T17:21:28Z Item was in collections: University of Illinois Theses & Dissertations (ID: 1) No. of bitstreams: 1 Sheikh_Zuhaib.pdf: 1071689 bytes, checksum: 289f0ed66ba2ada38dd90ccef3ef3e7a (MD5)","Made available in DSpace on 2011-01-14T22:48:52Z (GMT). No. of bitstreams: 2 Sheikh_Zuhaib.pdf: 1071689 bytes, checksum: 289f0ed66ba2ada38dd90ccef3ef3e7a (MD5) license.txt: 4062 bytes, checksum: 453e23e0f349762586ff0e6bc549202c (MD5)"]},{"key":"dc:title","label":"Title","values":["Numerical Modeling of Multi-Conductor Interconnects for High Speed Integrated Circuits"]}]}],"canonical_facts":{"dc:contributor":["Cangellaris, Andreas C."],"dc:creator":["Sheikh, Zuhaib B."],"dc:date":["2011-01-14T22:48:52Z","2010-12"],"dc:description":["Presented here is an alternative methodology to the development of transmission line models for multi-conductor interconnects in high speed integrated circuits. The methodology starts with the assumption that per unit length (p.u.l.) transmission line parameters — i.e. p.u.l. resistance R, inductance L, capacitance C, and conductance G — have been extracted using a two-dimensional RLCG extractor. The methodology relies upon a rational fitting algorithm called VECTFIT to express the parameters as a rational function expression, a form suitable for equivalent circuit generation using a commercial circuit simulator like HSPICE. The methodology has been numerically verified and implemented in the form of some select interconnecting scenarios for typical on-chip applications. The new methodology has also been compared with the previous methodology for robustness, accuracy and computational efficacy.","Item withdrawn by Alexis Thompson (athmpsn1@illinois.edu) on 2010-12-02T17:21:28Z Item was in collections: University of Illinois Theses & Dissertations (ID: 1) No. of bitstreams: 1 Sheikh_Zuhaib.pdf: 1071689 bytes, checksum: 289f0ed66ba2ada38dd90ccef3ef3e7a (MD5)","Made available in DSpace on 2011-01-14T22:48:52Z (GMT). No. of bitstreams: 2 Sheikh_Zuhaib.pdf: 1071689 bytes, checksum: 289f0ed66ba2ada38dd90ccef3ef3e7a (MD5) license.txt: 4062 bytes, checksum: 453e23e0f349762586ff0e6bc549202c (MD5)"],"dc:identifier":["http://hdl.handle.net/2142/18390"],"dc:language":["en"],"dc:rights":["Copyright 2010 Zuhaib B. Sheikh"],"dc:subject":["Transmission Line Model","Multi-conductor Interconnects","Two-dimensional RLCG extractor","Rational Fitting Algorithm","VECTFIT","HSPICE"],"dc:title":["Numerical Modeling of Multi-Conductor Interconnects for High Speed Integrated Circuits"],"thesis:degree_discipline":["Electrical & Computer Engr"],"thesis:degree_level":["Thesis"],"thesis:degree_name":["M.S."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:25:11Z"}