University of Illinois at Urbana-Champaign
Design of device-integrated heat sinks for liquid immersion cooling applications
Abstract
dc:descriptionThis thesis investigates the thermal management of electronic devices through immersion cooling, focusing on optimizing heat transfer efficiency in various coolant mediums. Rising power densities in electronics demand effective cooling solutions to mitigate temperature-related performance issues. Immersion cooling, particularly using dielectric fluids, emerges as a promising approach. The study analyzes heat transfer behavior in coolants such as air, water, ethylene glycol (WEG 52%), and Novec 7300, identifying optimal heat sink designs through mathematical modeling and simulation. Water exhibits superior heat transfer performance but poses electrical conductivity risks. WEG 52% and Novec 7300 offer safer alternatives, with Novec 7300 being compatible with fabrication processes. Practical considerations dictate coolant selection based on electrical safety, cost, and implementation ease. Water remains most effective, but insulation is required. Alternatively, Novec 7300 provides a safer option for real-time applications. This study offers insights into electronic device thermal management and provides guidelines for designing efficient immersion cooling systems tailored to specific needs, paving the way for future research in optimizing coolant selection and heat sink designs.
Degree
thesis:*- Name thesis:degree_name
- M.S.
- Level thesis:degree_level
- Thesis
- Discipline thesis:degree_discipline
- Mechanical Engineering
- Grantor
- University of Illinois at Urbana-Champaign
- Year dc:date
- 2024
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Aflatounian, Shayan
- Contributors dc:contributor
-
- Miljkovic, Nenad
Subjects
dc:subject × 4Rights
dc:rights- Statement dc:rights
-
- Copyright 2024 Shayan Aflatounian
- Language dc:language
- en, eng
Identifiers
dc:identifier.*- Handle dc:identifier
- https://hdl.handle.net/2142/124266