{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/124266"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/124266","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Design of device-integrated heat sinks for liquid immersion cooling applications","abstract":"Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2024-09-16 without embargo terms","abstract_html":"Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2024-09-16 without embargo terms","abstract_has_math":false,"creators":["Aflatounian, Shayan"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"M.S.","degree_level":"Thesis","degree_discipline":"Mechanical Engineering","degree_department":null,"school":null,"contributors":["Miljkovic, Nenad"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2024,"date_issued":"2024-05","date_published":"2024-05","updated_at":"2026-07-22T22:25:00Z","subjects":["Thermal Management","Immersion Cooling","Optimal Heat Sink Designs","Dielectric Fluids"],"languages":["en","eng"],"rights":["Copyright 2024 Shayan Aflatounian"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"https://hdl.handle.net/2142/124266","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Miljkovic, Nenad"]},{"key":"dc:creator","label":"Author","values":["Aflatounian, Shayan"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2024-05","2024-04-30"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Mechanical Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Thesis"]},{"key":"thesis:degree_name","label":"Degree Name","values":["M.S."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Thermal Management","Immersion Cooling","Optimal Heat Sink Designs","Dielectric Fluids"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en","eng"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2024 Shayan Aflatounian"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["https://hdl.handle.net/2142/124266"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2024-09-16 without embargo terms","The student, Shayan Aflatounian, accepted the attached license on 2024-04-12 at 11:47.","The student, Shayan Aflatounian, submitted this Thesis for approval on 2024-04-12 at 11:54.","This Thesis was approved for publication on 2024-04-30 at 16:52.","DSpace SAF Submission Ingestion Package generated from Vireo submission #20380 on 2024-09-16 at 00:34:04","This thesis investigates the thermal management of electronic devices through immersion cooling, focusing on optimizing heat transfer efficiency in various coolant mediums. Rising power densities in electronics demand effective cooling solutions to mitigate temperature-related performance issues. Immersion cooling, particularly using dielectric fluids, emerges as a promising approach. The study analyzes heat transfer behavior in coolants such as air, water, ethylene glycol (WEG 52%), and Novec 7300, identifying optimal heat sink designs through mathematical modeling and simulation. Water exhibits superior heat transfer performance but poses electrical conductivity risks. WEG 52% and Novec 7300 offer safer alternatives, with Novec 7300 being compatible with fabrication processes. Practical considerations dictate coolant selection based on electrical safety, cost, and implementation ease. Water remains most effective, but insulation is required. Alternatively, Novec 7300 provides a safer option for real-time applications. This study offers insights into electronic device thermal management and provides guidelines for designing efficient immersion cooling systems tailored to specific needs, paving the way for future research in optimizing coolant selection and heat sink designs."]},{"key":"dc:format","label":"Dc Format","values":["application/pdf"]},{"key":"dc:title","label":"Title","values":["Design of device-integrated heat sinks for liquid immersion cooling applications"]}]}],"canonical_facts":{"dc:contributor":["Miljkovic, Nenad"],"dc:creator":["Aflatounian, Shayan"],"dc:date":["2024-05","2024-04-30"],"dc:description":["Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2024-09-16 without embargo terms","The student, Shayan Aflatounian, accepted the attached license on 2024-04-12 at 11:47.","The student, Shayan Aflatounian, submitted this Thesis for approval on 2024-04-12 at 11:54.","This Thesis was approved for publication on 2024-04-30 at 16:52.","DSpace SAF Submission Ingestion Package generated from Vireo submission #20380 on 2024-09-16 at 00:34:04","This thesis investigates the thermal management of electronic devices through immersion cooling, focusing on optimizing heat transfer efficiency in various coolant mediums. Rising power densities in electronics demand effective cooling solutions to mitigate temperature-related performance issues. Immersion cooling, particularly using dielectric fluids, emerges as a promising approach. The study analyzes heat transfer behavior in coolants such as air, water, ethylene glycol (WEG 52%), and Novec 7300, identifying optimal heat sink designs through mathematical modeling and simulation. Water exhibits superior heat transfer performance but poses electrical conductivity risks. WEG 52% and Novec 7300 offer safer alternatives, with Novec 7300 being compatible with fabrication processes. Practical considerations dictate coolant selection based on electrical safety, cost, and implementation ease. Water remains most effective, but insulation is required. Alternatively, Novec 7300 provides a safer option for real-time applications. This study offers insights into electronic device thermal management and provides guidelines for designing efficient immersion cooling systems tailored to specific needs, paving the way for future research in optimizing coolant selection and heat sink designs."],"dc:format":["application/pdf"],"dc:identifier":["https://hdl.handle.net/2142/124266"],"dc:language":["en","eng"],"dc:rights":["Copyright 2024 Shayan Aflatounian"],"dc:subject":["Thermal Management","Immersion Cooling","Optimal Heat Sink Designs","Dielectric Fluids"],"dc:title":["Design of device-integrated heat sinks for liquid immersion cooling applications"],"dc:type":["text"],"thesis:degree_discipline":["Mechanical Engineering"],"thesis:degree_level":["Thesis"],"thesis:degree_name":["M.S."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:25:00Z"}