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University of Illinois at Urbana-Champaign

Investigating surface behavior of copper electrodeposition electrolytes and additives

Abstract

dc:description

Embargo set by: Seth Robbins for item 113002 Lift date: 2021-11-26T20:56:50Z Reason: Author requested closed access (OA after 2yrs) in Vireo ETD system

Degree

thesis:*
Name thesis:degree_name
Ph.D.
Level thesis:degree_level
Dissertation
Discipline thesis:degree_discipline
Chemistry
Grantor
University of Illinois at Urbana-Champaign
Year dc:date
2019

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Rooney, Ryan T.
Contributors dc:contributor
  • Gewirth, Andrew A
  • Girolami, Greg S
  • Kenis, Paul J
  • Nuzzo, Ralph G

Subjects

dc:subject × 13

Rights

dc:rights
Statement dc:rights
  • Copyright 2019 Ryan Rooney
Language dc:language
en

Identifiers

dc:identifier.*
Handle dc:identifier
http://hdl.handle.net/2142/105857

Chain of custody

source
Harvested from
University of Illinois - Urbana-Champaign
Base URL
www.ideals.illinois.edu/oai-pmh
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Rooney, Ryan T.. Investigating surface behavior of copper electrodeposition electrolytes and additives. Dissertation thesis, University of Illinois at Urbana-Champaign, 2019. http://hdl.handle.net/2142/105857