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University of Illinois at Urbana-Champaign

Investigating surface behavior of copper electrodeposition electrolytes and additives

dc:creator Rooney, Ryan T.

thesis:degree_name Ph.D.

dc:date2019

Abstract

dc:description

DSpace SAF Submission Ingestion Package generated from Vireo submission #14012 on 2019-11-26 at 13:59:34

Degree

thesis:*

Name thesis:degree_name: Ph.D.
Level thesis:degree_level: Dissertation
Discipline thesis:degree_discipline: Chemistry
Grantor: University of Illinois at Urbana-Champaign
Year dc:date: 2019

Author and committee

dc:creator, dc:contributor.*

Author dc:creator: Rooney, Ryan T.
Contributors dc:contributor: Gewirth, Andrew A
Girolami, Greg S
Kenis, Paul J
Nuzzo, Ralph G

Subjects

dc:subject × 13

Rights

dc:rights

Statement dc:rights: Copyright 2019 Ryan Rooney
Language dc:language: en

Identifiers

dc:identifier.*

Handle dc:identifier: http://hdl.handle.net/2142/105857
OAI identifier oai:identifier: oai:www.ideals.illinois.edu:2142/105857

Chain of custody

source

Harvested from: University of Illinois - Urbana-Champaign
Base URL: www.ideals.illinois.edu/oai-pmh
Last updated: 2026-07-22
Source record: OAI-PMH GetRecord

related terms

citation

Rooney, Ryan T.. Investigating surface behavior of copper electrodeposition electrolytes and additives. Dissertation thesis, University of Illinois at Urbana-Champaign, 2019. http://hdl.handle.net/2142/105857

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