Back to search
University of Illinois at Urbana-Champaign
Atmospheric pressure plasma chemical vapor deposition of silicon dioxide for improved adhesion and water intrusion resistance for lightweight manufacturing
Abstract
dc:descriptionSubmission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2024-03-01 without embargo terms
Degree
thesis:*- Name thesis:degree_name
- M.S.
- Level thesis:degree_level
- Thesis
- Discipline thesis:degree_discipline
- Nuclear, Plasma, Radiolgc Engr
- Grantor
- University of Illinois at Urbana-Champaign
- Year dc:date
- 2023
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Jeckell, Zachary Jon
- Contributors dc:contributor
-
- Ruzic, David N
- Sankaran, Mohan
Subjects
dc:subject × 6Rights
dc:rights- Statement dc:rights
-
- Copyright 2023 Zachary Jeckell
- Language dc:language
- en, eng
Identifiers
dc:identifier.*- Handle dc:identifier
- https://hdl.handle.net/2142/122063
- OAI identifier oai:identifier
- oai:www.ideals.illinois.edu:2142/122063