Printed microscale mono-crystalline silicon on flexible substrates for photovoltaic, strain sensors, and neural interface applications

In recent years, research in flexible electronic systems has increased due to its potential to create and manipulate new classes of applications (e.g., foldable and flexible display, flexible photovoltaic, epidermal electronics, and other systems) that can be integrated outside of conventional wafer-based electronics. With suitable choice of materials and design strategies, inorganic semiconductors (e.g., Si and GaAs) can be used on unconventional substrates for mechanical flexibility and high electrical performance. This dissertation presents the fabrication of mono-crystalline Si electronics by using top-down approaches. We describe five related topics of ultra-thin Si electronics which involve forming structures and assembling them by structured or non-structured elastomeric stamps or bulk wafer etching techniques. Furthermore, this dissertation demonstrates a strategy in which modules consist of large-scale arrays of interconnected high-performance ultra-thin Si electronics that are mechanically flexible, stretchable, and semitransparent, along with in-depth studies of their electrical and mechanical properties and applications.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Electrical & Computer Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2016

Author dc:creator

• Yu, Ki Jun

Contributors dc:contributor

• Rogers, John A.
• Lyding, Joseph W.
• Li, Xiuling
• Liu, Gang L.

• Ultra-thin silicon
• flexible and stretchable electronics

Statement dc:rights

• Copyright 2015 Ki Jun Yu

Language dc:language

en

Handle dc:identifier

http://hdl.handle.net/2142/89203

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/89203