{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/89203"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/89203","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Printed microscale mono-crystalline silicon on flexible substrates for photovoltaic, strain sensors, and neural interface applications","abstract":"In recent years, research in flexible electronic systems has increased due to its potential to create and manipulate new classes of applications (e.g., foldable and flexible display, flexible photovoltaic, epidermal electronics, and other systems) that can be integrated outside of conventional wafer-based electronics. With suitable choice of materials and design strategies, inorganic semiconductors (e.g., Si and GaAs) can be used on unconventional substrates for mechanical flexibility and high electrical performance. This dissertation presents the fabrication of mono-crystalline Si electronics by using top-down approaches. We describe five related topics of ultra-thin Si electronics which involve forming structures and assembling them by structured or non-structured elastomeric stamps or bulk wafer etching techniques. Furthermore, this dissertation demonstrates a strategy in which modules consist of large-scale arrays of interconnected high-performance ultra-thin Si electronics that are mechanically flexible, stretchable, and semitransparent, along with in-depth studies of their electrical and mechanical properties and applications.","abstract_html":"In recent years, research in flexible electronic systems has increased due to its potential to create and manipulate new classes of applications (e.g., foldable and flexible display, flexible photovoltaic, epidermal electronics, and other systems) that can be integrated outside of conventional wafer-based electronics. With suitable choice of materials and design strategies, inorganic semiconductors (e.g., Si and GaAs) can be used on unconventional substrates for mechanical flexibility and high electrical performance. This dissertation presents the fabrication of mono-crystalline Si electronics by using top-down approaches. We describe five related topics of ultra-thin Si electronics which involve forming structures and assembling them by structured or non-structured elastomeric stamps or bulk wafer etching techniques. Furthermore, this dissertation demonstrates a strategy in which modules consist of large-scale arrays of interconnected high-performance ultra-thin Si electronics that are mechanically flexible, stretchable, and semitransparent, along with in-depth studies of their electrical and mechanical properties and applications.","abstract_has_math":false,"creators":["Yu, Ki Jun"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"Ph.D.","degree_level":"Dissertation","degree_discipline":"Electrical & Computer Engineering","degree_department":null,"school":null,"contributors":["Rogers, John A.","Lyding, Joseph W.","Li, Xiuling","Liu, Gang L."],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2016,"date_issued":"2016-03-02T21:06:33Z","date_published":"2016-03-02T21:06:33Z","updated_at":"2026-07-22T22:26:32Z","subjects":["Ultra-thin silicon","flexible and stretchable electronics"],"languages":["en"],"rights":["Copyright 2015 Ki Jun Yu"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/2142/89203","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Rogers, John A.","Lyding, Joseph W.","Li, Xiuling","Liu, Gang L."]},{"key":"dc:creator","label":"Author","values":["Yu, Ki Jun"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2016-03-02T21:06:33Z","2018-03-03T10:15:35Z","2015-11-18","2015-12"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Electrical & Computer Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Ph.D."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Ultra-thin silicon","flexible and stretchable electronics"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2015 Ki Jun Yu"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/89203"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["In recent years, research in flexible electronic systems has increased due to its potential to create and manipulate new classes of applications (e.g., foldable and flexible display, flexible photovoltaic, epidermal electronics, and other systems) that can be integrated outside of conventional wafer-based electronics. With suitable choice of materials and design strategies, inorganic semiconductors (e.g., Si and GaAs) can be used on unconventional substrates for mechanical flexibility and high electrical performance. This dissertation presents the fabrication of mono-crystalline Si electronics by using top-down approaches. We describe five related topics of ultra-thin Si electronics which involve forming structures and assembling them by structured or non-structured elastomeric stamps or bulk wafer etching techniques. Furthermore, this dissertation demonstrates a strategy in which modules consist of large-scale arrays of interconnected high-performance ultra-thin Si electronics that are mechanically flexible, stretchable, and semitransparent, along with in-depth studies of their electrical and mechanical properties and applications.","Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2017-12-01","The student, Ki Jun Yu, accepted the attached license on 2015-11-16 at 18:34.","The student, Ki Jun Yu, submitted this Dissertation for approval on 2015-11-16 at 18:53.","This Dissertation was approved for publication on 2015-11-18 at 17:03.","DSpace SAF Submission Ingestion Package generated from Vireo submission #8793 on 2016-03-02 at 14:13:11","Made available in DSpace on 2016-03-02T21:06:33Z (GMT). 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With suitable choice of materials and design strategies, inorganic semiconductors (e.g., Si and GaAs) can be used on unconventional substrates for mechanical flexibility and high electrical performance. This dissertation presents the fabrication of mono-crystalline Si electronics by using top-down approaches. We describe five related topics of ultra-thin Si electronics which involve forming structures and assembling them by structured or non-structured elastomeric stamps or bulk wafer etching techniques. Furthermore, this dissertation demonstrates a strategy in which modules consist of large-scale arrays of interconnected high-performance ultra-thin Si electronics that are mechanically flexible, stretchable, and semitransparent, along with in-depth studies of their electrical and mechanical properties and applications.","Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2017-12-01","The student, Ki Jun Yu, accepted the attached license on 2015-11-16 at 18:34.","The student, Ki Jun Yu, submitted this Dissertation for approval on 2015-11-16 at 18:53.","This Dissertation was approved for publication on 2015-11-18 at 17:03.","DSpace SAF Submission Ingestion Package generated from Vireo submission #8793 on 2016-03-02 at 14:13:11","Made available in DSpace on 2016-03-02T21:06:33Z (GMT). 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