Delamination of Thin Film Patterns Using Laser-Induced Stress Waves

A more complete description of the dynamic interfacial crack propagation is obtained by monitoring the crack tip location during the delamination event. The dynamic delamination technique eliminates the need for external contact and complex bonding processes. The stress wave generation is highly repeatable, multiple tests can be carried out on a single substrate, and final calculation of the interfacial energy does not require a complex stress analysis. Overall, this experimental methodology offers great potential to address the long standing problem of adhesive failure and delamination in multilayer thin film devices.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Aerospace Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2015

Author dc:creator

• Kandula, Soma Sekhar Venkata

Contributors dc:contributor

• Sottos, Nancy R.

• Engineering, Mechanical

Language dc:language

eng

Identifier

(MiAaPQ)AAI3314811

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/85110