{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/85110"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/85110","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Delamination of Thin Film Patterns Using Laser-Induced Stress Waves","abstract":"A more complete description of the dynamic interfacial crack propagation is obtained by monitoring the crack tip location during the delamination event. The dynamic delamination technique eliminates the need for external contact and complex bonding processes. The stress wave generation is highly repeatable, multiple tests can be carried out on a single substrate, and final calculation of the interfacial energy does not require a complex stress analysis. Overall, this experimental methodology offers great potential to address the long standing problem of adhesive failure and delamination in multilayer thin film devices.","abstract_html":"A more complete description of the dynamic interfacial crack propagation is obtained by monitoring the crack tip location during the delamination event. The dynamic delamination technique eliminates the need for external contact and complex bonding processes. The stress wave generation is highly repeatable, multiple tests can be carried out on a single substrate, and final calculation of the interfacial energy does not require a complex stress analysis. Overall, this experimental methodology offers great potential to address the long standing problem of adhesive failure and delamination in multilayer thin film devices.","abstract_has_math":false,"creators":["Kandula, Soma Sekhar Venkata"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"Ph.D.","degree_level":"Dissertation","degree_discipline":"Aerospace Engineering","degree_department":null,"school":null,"contributors":["Sottos, Nancy R."],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2015,"date_issued":"2015-09-25T22:34:27Z","date_published":"2015-09-25T22:34:27Z","updated_at":"2026-07-22T22:26:24Z","subjects":["Engineering, Mechanical"],"languages":["eng"],"rights":[],"rights_urls":[],"identifier_entries":[{"key":"dc:identifier","label":"Identifier","values":["(MiAaPQ)AAI3314811"],"render_values":[{"text":"(MiAaPQ)AAI3314811","href":null,"code":true}]}]},"links":{"outbound_url":"http://hdl.handle.net/2142/85110","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Sottos, Nancy R."]},{"key":"dc:creator","label":"Author","values":["Kandula, Soma Sekhar Venkata"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2015-09-25T22:34:27Z","10000-01-01","2008"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Aerospace Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Ph.D."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Engineering, Mechanical"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["eng"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/85110","(MiAaPQ)AAI3314811"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["A more complete description of the dynamic interfacial crack propagation is obtained by monitoring the crack tip location during the delamination event. The dynamic delamination technique eliminates the need for external contact and complex bonding processes. The stress wave generation is highly repeatable, multiple tests can be carried out on a single substrate, and final calculation of the interfacial energy does not require a complex stress analysis. Overall, this experimental methodology offers great potential to address the long standing problem of adhesive failure and delamination in multilayer thin film devices.","Made available in DSpace on 2015-09-25T22:34:27Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 3314811.pdf: 1884221 bytes, checksum: da27a6b32916b29d459b3a3d6ff60323 (MD5) Previous issue date: 2008","Embargo set by: Seth Robbins for item 86391 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs","Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs","U of I Only","100 p.","Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2008."]},{"key":"dc:title","label":"Title","values":["Delamination of Thin Film Patterns Using Laser-Induced Stress Waves"]}]}],"canonical_facts":{"dc:contributor":["Sottos, Nancy R."],"dc:creator":["Kandula, Soma Sekhar Venkata"],"dc:date":["2015-09-25T22:34:27Z","10000-01-01","2008"],"dc:description":["A more complete description of the dynamic interfacial crack propagation is obtained by monitoring the crack tip location during the delamination event. The dynamic delamination technique eliminates the need for external contact and complex bonding processes. The stress wave generation is highly repeatable, multiple tests can be carried out on a single substrate, and final calculation of the interfacial energy does not require a complex stress analysis. Overall, this experimental methodology offers great potential to address the long standing problem of adhesive failure and delamination in multilayer thin film devices.","Made available in DSpace on 2015-09-25T22:34:27Z (GMT). No. of bitstreams: 2 license.txt: 4848 bytes, checksum: 96035ab3f5e1c23cc7138a224ce498bd (MD5) 3314811.pdf: 1884221 bytes, checksum: da27a6b32916b29d459b3a3d6ff60323 (MD5) Previous issue date: 2008","Embargo set by: Seth Robbins for item 86391 Lift date: Forever Reason: Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs","Restricted to the U of I community idenfinitely during batch ingest of legacy ETDs","U of I Only","100 p.","Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2008."],"dc:identifier":["http://hdl.handle.net/2142/85110","(MiAaPQ)AAI3314811"],"dc:language":["eng"],"dc:subject":["Engineering, Mechanical"],"dc:title":["Delamination of Thin Film Patterns Using Laser-Induced Stress Waves"],"dc:type":["text"],"thesis:degree_discipline":["Aerospace Engineering"],"thesis:degree_level":["Dissertation"],"thesis:degree_name":["Ph.D."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:26:24Z"}