Dimensional Accuracy of Thermoset Polymer Composites: Process Simulation and Optimization

Finally, the three-dimensional finite element code is utilized to predict the viscoelastic response of a woven composite substrate for multilayer circuit board applications. Comparisons between numerical predictions and experimental data clearly indicate that the creep compliance of the composite depends not only on the relaxation of the matrix, but also on flexural deformations of the woven fabric bundles.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Aerospace Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2015

Author dc:creator

• Zhu, Qi

Contributors dc:contributor

• Geubelle, Philippe H.

• Engineering, Mechanical

Language dc:language

eng

Identifier

(MiAaPQ)AAI3017266

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/85068