{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/85068"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/85068","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Dimensional Accuracy of Thermoset Polymer Composites: Process Simulation and Optimization","abstract":"Finally, the three-dimensional finite element code is utilized to predict the viscoelastic response of a woven composite substrate for multilayer circuit board applications. Comparisons between numerical predictions and experimental data clearly indicate that the creep compliance of the composite depends not only on the relaxation of the matrix, but also on flexural deformations of the woven fabric bundles.","abstract_html":"Finally, the three-dimensional finite element code is utilized to predict the viscoelastic response of a woven composite substrate for multilayer circuit board applications. 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