Compliant Meso-Scale Grinding of Silicon

To further improve form accuracy obtained on the compliant grinding apparatus, a normal grinding force model and a depth of cut model were developed to account for the large compliance in the grinding system. Numerical simulation was performed to predict actual depths of cut and the results were within 6% of the measured/actual depths.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Mechanical Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2015

Author dc:creator

• Jiang, Bo

Contributors dc:contributor

• Philpott, Michael L.
• Shannon, Mark A.

• Engineering, Materials Science

Language dc:language

eng

Identifier

(MiAaPQ)AAI3153333

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/83813