Design of Novel High Temperature Thermosetting Resins Tailored to Specific Needs

ATSP was applied as a high temperature adhesive for copper foils in order to improve the performance and the reliability of microelectronic devices. Zn-coated Cu foil displayed significantly higher adhesion to ATSP than Cu foils and Ni-coated Cu foils. The improvement is due to the stronger mechanical interlocking effect and stronger chemical interaction at the interface. Failure mechanism of Zn-coated Cu foil with ATSP was both cohesive and adhesive. Only adhesive failure occurred at the ATSP/Cu and ATSP/Ni interface.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Materials Science and Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2015

Author dc:creator

• Huang, Yongqing

Contributors dc:contributor

• Economy, James

• Engineering, Materials Science

Language dc:language

eng

Identifier

(MiAaPQ)AAI3199206

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/82774