{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/82774"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/82774","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Design of Novel High Temperature Thermosetting Resins Tailored to Specific Needs","abstract":"ATSP was applied as a high temperature adhesive for copper foils in order to improve the performance and the reliability of microelectronic devices. Zn-coated Cu foil displayed significantly higher adhesion to ATSP than Cu foils and Ni-coated Cu foils. The improvement is due to the stronger mechanical interlocking effect and stronger chemical interaction at the interface. Failure mechanism of Zn-coated Cu foil with ATSP was both cohesive and adhesive. Only adhesive failure occurred at the ATSP/Cu and ATSP/Ni interface.","abstract_html":"ATSP was applied as a high temperature adhesive for copper foils in order to improve the performance and the reliability of microelectronic devices. Zn-coated Cu foil displayed significantly higher adhesion to ATSP than Cu foils and Ni-coated Cu foils. The improvement is due to the stronger mechanical interlocking effect and stronger chemical interaction at the interface. Failure mechanism of Zn-coated Cu foil with ATSP was both cohesive and adhesive. 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Zn-coated Cu foil displayed significantly higher adhesion to ATSP than Cu foils and Ni-coated Cu foils. The improvement is due to the stronger mechanical interlocking effect and stronger chemical interaction at the interface. Failure mechanism of Zn-coated Cu foil with ATSP was both cohesive and adhesive. Only adhesive failure occurred at the ATSP/Cu and ATSP/Ni interface.","Made available in DSpace on 2015-09-25T20:52:58Z (GMT). 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Zn-coated Cu foil displayed significantly higher adhesion to ATSP than Cu foils and Ni-coated Cu foils. The improvement is due to the stronger mechanical interlocking effect and stronger chemical interaction at the interface. Failure mechanism of Zn-coated Cu foil with ATSP was both cohesive and adhesive. Only adhesive failure occurred at the ATSP/Cu and ATSP/Ni interface.","Made available in DSpace on 2015-09-25T20:52:58Z (GMT). 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