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University of Illinois at Urbana-Champaign
In Situ Infrared Spectroscopic Studies of Electrodeposition Additive Adsorption on Copper
Abstract
dc:descriptionCTA with bisulfate counterion promoted smooth electrodeposits. Secondary ion mass spectroscopy (SIMS) depth profiles indicated that CTA was not significantly incorporated into copper deposits grown in the presence of CTA with HSO$\sb4\sp-$ counterion, except at very high overpotentials ($>$500 mV). Depth profiles of deposits grown in the presence of thiourea showed incorporation of the thiourea predominantly as sulfur. Depth profiles of deposits grown in the presence of CTA with Br$\sp-$ at sufficiently large overpotentials for electrodeposition rates to be appreciable (about 500 mV) indicated incorporation of CTA and Br. Such deposits also showed very nonuniform morphologies.
Degree
thesis:*- Name thesis:degree_name
- Ph.D.
- Level thesis:degree_level
- Dissertation
- Discipline thesis:degree_discipline
- Chemical Engineering
- Grantor
- University of Illinois at Urbana-Champaign
- Year dc:date
- 2015
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Papapanayiotou, Demetrius
- Contributors dc:contributor
-
- Alkire, Richard C.
Subjects
dc:subject × 1Rights
- Language dc:language
- eng
Identifiers
dc:identifier.*- Identifier
- (MiAaPQ)AAI9717324
- OAI identifier oai:identifier
- oai:www.ideals.illinois.edu:2142/82435