Design Automation for Reliable CMOS Chip Input/output Circuits

Thermal failure is one of the most prevalent failure mechanism during the Human Body Model (HBM) ESD stress. Previous circuit thermal model (integrator circuit) in iETSIM only applies for constant current stress. A general thermal model using convolution is developed. New techniques are proposed to implement a thermal convolver, including regionwise-exponential (RWE) approximation and recursive convolution. The efficiency of the new thermal convolver makes it feasible to simulate a CMOS circuit containing many devices within a short time.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Computer Science

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2015

Author dc:creator

• Li, Tong

Contributors dc:contributor

• Kang, Sung-Mo (Steve)

• Engineering, Electronics and Electrical

Language dc:language

eng

Identifier

(MiAaPQ)AAI9912304

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/81930