{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/81930"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/81930","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Design Automation for Reliable CMOS Chip Input/output Circuits","abstract":"Thermal failure is one of the most prevalent failure mechanism during the Human Body Model (HBM) ESD stress. Previous circuit thermal model (integrator circuit) in iETSIM only applies for constant current stress. A general thermal model using convolution is developed. New techniques are proposed to implement a thermal convolver, including regionwise-exponential (RWE) approximation and recursive convolution. 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