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University of Illinois at Urbana-Champaign
Routing Algorithms for High-Performance VLSI Packaging
Abstract
dc:descriptionAs the package densities are increasing, escape routing is becoming the main bottleneck in terms of overall routability. For this, we propose novel models and algorithms to solve the escape routing problem in multiple components simultaneously, such that the number of crossings in the intermediate area (between components) is minimized. Finally, we focus on the problem of escape routing within dense pin clusters, which can have arbitrary convex boundaries. We propose a set of sufficient and necessary conditions that guarantee routability outside the escape boundaries. We also discuss how these conditions can be incorporated effectively into an escape routing algorithm.
Degree
thesis:*- Name thesis:degree_name
- Ph.D.
- Level thesis:degree_level
- Dissertation
- Discipline thesis:degree_discipline
- Computer Science
- Grantor
- University of Illinois at Urbana-Champaign
- Year dc:date
- 2015
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Ozdal, Muhammet Mustafa
- Contributors dc:contributor
-
- Wong, Martin D.F.
Subjects
dc:subject × 1Rights
- Language dc:language
- eng
Identifiers
dc:identifier.*- Identifier
- (MiAaPQ)AAI3199107
- OAI identifier oai:identifier
- oai:www.ideals.illinois.edu:2142/81689