{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/81689"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/81689","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Routing Algorithms for High-Performance VLSI Packaging","abstract":"As the package densities are increasing, escape routing is becoming the main bottleneck in terms of overall routability. For this, we propose novel models and algorithms to solve the escape routing problem in multiple components simultaneously, such that the number of crossings in the intermediate area (between components) is minimized. Finally, we focus on the problem of escape routing within dense pin clusters, which can have arbitrary convex boundaries. We propose a set of sufficient and necessary conditions that guarantee routability outside the escape boundaries. 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