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University of Illinois at Urbana-Champaign
Temperature -Aware VLSI Design and Analysis
Abstract
dc:descriptionThe algorithms and methods developed in this work provide a firm foundation upon which to construct a more effective framework for temperature-sensitive VLSI design and analysis. This work attempts to provide a comprehensive temperature- and reliability-conscious design solution for dealing with emerging thermal and reliability issues.
Degree
thesis:*- Name thesis:degree_name
- Ph.D.
- Level thesis:degree_level
- Dissertation
- Discipline thesis:degree_discipline
- Electrical Engineering
- Grantor
- University of Illinois at Urbana-Champaign
- Year dc:date
- 2015
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Tsai, Ching-Han
- Contributors dc:contributor
-
- Kang, Sung-Mo (Steve)
Subjects
dc:subject × 1Rights
- Language dc:language
- eng
Identifiers
dc:identifier.*- Identifier
- (MiAaPQ)AAI9990172
- OAI identifier oai:identifier
- oai:www.ideals.illinois.edu:2142/81363