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University of Illinois at Urbana-Champaign

Thermally Generated Traps in Boron Implanted Phosphorus Doped Silicon (Semiconductor, Defect)

Abstract

dc:description

The generation-recombination-trapping centers formed by the heat treatment of boron implanted, phosphorus doped silicon were studied using capacitance transient techniques. Measurements were made of the carrier thermal emission rates, emission cross sections, and activation energies for two thermally generated hole traps and six thermally generated electron traps. These traps do not appear to be present in the silicon immediately after implantation; they are formed by heat treatment of the damaged silicon at temperatures near 400C.

Degree

thesis:*
Name thesis:degree_name
Ph.D.
Level thesis:degree_level
Dissertation
Discipline thesis:degree_discipline
Electrical Engineering
Grantor
University of Illinois at Urbana-Champaign
Year dc:date
2014

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Jackson, Daniel Brian

Subjects

dc:subject × 1

Identifiers

dc:identifier.*
Identifier
(UMI)AAI8600217
OAI identifier oai:identifier
oai:www.ideals.illinois.edu:2142/69323

Chain of custody

source
Harvested from
University of Illinois - Urbana-Champaign
Base URL
www.ideals.illinois.edu/oai-pmh
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Jackson, Daniel Brian. Thermally Generated Traps in Boron Implanted Phosphorus Doped Silicon (Semiconductor, Defect). Dissertation thesis, University of Illinois at Urbana-Champaign, 2014. http://hdl.handle.net/2142/69323