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University of Illinois at Urbana-Champaign

Signal integrity analysis of high-speed multilayer interconnects using the finite element method

Abstract

dc:description

Approaches of modeling high-speed interconnect generally fall into two categories: circuit models based on circuit-parameter extractions and full-wave methods based on solving Maxwell's equations. Even though computationally efficient, the approaches based on circuit-parameter extractions fail to provide accurate predictions due to the increased coupling and radiation effects at high frequencies. This work targets the fast and efficient full-wave analysis of high-speed multilayer interconnects. To enhance the efficiency of the full-wave analysis, fast frequency sweep techniques and domain decomposition schemes are first investigated and then implemented. This work consists of four major parts. (1) The full-wave analysis is implemented based on the finite element method. The capability of handling arbitrary geometries of the finite element method is utilized to deal with complex circuit structures. (2) The efficiency of the full-wave method is enhanced for broadband characterization by the incorporation of the solution space projection. (3) Various domain decomposition schemes are employed to break an originally large problem into smaller ones and allow the possibility of parallel computing. (4) The solution space projection and the domain decomposition schemes are combined in a mutually beneficial manner which achieves an even more efficient full-wave analysis.

Degree

thesis:*
Name thesis:degree_name
M.S.
Level thesis:degree_level
Thesis
Discipline thesis:degree_discipline
Electrical & Computer Engr
Grantor
University of Illinois at Urbana-Champaign
Year dc:date
2013

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Lu, Tianjian
Contributors dc:contributor
  • Jin, Jianming

Subjects

dc:subject × 6

Rights

dc:rights
Statement dc:rights
  • Copyright 2012 Tianjian Lu
Language dc:language
en

Identifiers

dc:identifier.*
Handle dc:identifier
http://hdl.handle.net/2142/42119
OAI identifier oai:identifier
oai:www.ideals.illinois.edu:2142/42119

Chain of custody

source
Harvested from
University of Illinois - Urbana-Champaign
Base URL
www.ideals.illinois.edu/oai-pmh
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Lu, Tianjian. Signal integrity analysis of high-speed multilayer interconnects using the finite element method. Thesis thesis, University of Illinois at Urbana-Champaign, 2013. http://hdl.handle.net/2142/42119