{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/42119"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/42119","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Signal integrity analysis of high-speed multilayer interconnects using the finite element method","abstract":"Approaches of modeling high-speed interconnect generally fall into two categories: circuit models based on circuit-parameter extractions and full-wave methods based on solving Maxwell's equations. Even though computationally efficient, the approaches based on circuit-parameter extractions fail to provide accurate predictions due to the increased coupling and radiation effects at high frequencies. This work targets the fast and efficient full-wave analysis of high-speed multilayer interconnects. To enhance the efficiency of the full-wave analysis, fast frequency sweep techniques and domain decomposition schemes are first investigated and then implemented. This work consists of four major parts. (1) The full-wave analysis is implemented based on the finite element method. The capability of handling arbitrary geometries of the finite element method is utilized to deal with complex circuit structures. (2) The efficiency of the full-wave method is enhanced for broadband characterization by the incorporation of the solution space projection. (3) Various domain decomposition schemes are employed to break an originally large problem into smaller ones and allow the possibility of parallel computing. (4) The solution space projection and the domain decomposition schemes are combined in a mutually beneficial manner which achieves an even more efficient full-wave analysis.","abstract_html":"Approaches of modeling high-speed interconnect generally fall into two categories: circuit models based on circuit-parameter extractions and full-wave methods based on solving Maxwell&#x27;s equations. Even though computationally efficient, the approaches based on circuit-parameter extractions fail to provide accurate predictions due to the increased coupling and radiation effects at high frequencies. This work targets the fast and efficient full-wave analysis of high-speed multilayer interconnects. To enhance the efficiency of the full-wave analysis, fast frequency sweep techniques and domain decomposition schemes are first investigated and then implemented. This work consists of four major parts. (1) The full-wave analysis is implemented based on the finite element method. The capability of handling arbitrary geometries of the finite element method is utilized to deal with complex circuit structures. (2) The efficiency of the full-wave method is enhanced for broadband characterization by the incorporation of the solution space projection. (3) Various domain decomposition schemes are employed to break an originally large problem into smaller ones and allow the possibility of parallel computing. (4) The solution space projection and the domain decomposition schemes are combined in a mutually beneficial manner which achieves an even more efficient full-wave analysis.","abstract_has_math":false,"creators":["Lu, Tianjian"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"M.S.","degree_level":"Thesis","degree_discipline":"Electrical & Computer Engr","degree_department":null,"school":null,"contributors":["Jin, Jianming"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2013,"date_issued":"2013-02-03T19:16:11Z","date_published":"2013-02-03T19:16:11Z","updated_at":"2026-07-22T22:25:31Z","subjects":["Signal Integrity","Multilayer Interconnects","Full-Wave Analysis","Finite Element Method","Fast Frequency Sweep","Domain Decomposition"],"languages":["en"],"rights":["Copyright 2012 Tianjian Lu"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/2142/42119","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Jin, Jianming"]},{"key":"dc:creator","label":"Author","values":["Lu, Tianjian"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2013-02-03T19:16:11Z","2015-02-03T11:00:27Z","2012-12"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Electrical & Computer Engr"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Thesis"]},{"key":"thesis:degree_name","label":"Degree Name","values":["M.S."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Signal Integrity","Multilayer Interconnects","Full-Wave Analysis","Finite Element Method","Fast Frequency Sweep","Domain Decomposition"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2012 Tianjian Lu"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/42119"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Approaches of modeling high-speed interconnect generally fall into two categories: circuit models based on circuit-parameter extractions and full-wave methods based on solving Maxwell's equations. Even though computationally efficient, the approaches based on circuit-parameter extractions fail to provide accurate predictions due to the increased coupling and radiation effects at high frequencies. This work targets the fast and efficient full-wave analysis of high-speed multilayer interconnects. To enhance the efficiency of the full-wave analysis, fast frequency sweep techniques and domain decomposition schemes are first investigated and then implemented. This work consists of four major parts. (1) The full-wave analysis is implemented based on the finite element method. The capability of handling arbitrary geometries of the finite element method is utilized to deal with complex circuit structures. (2) The efficiency of the full-wave method is enhanced for broadband characterization by the incorporation of the solution space projection. (3) Various domain decomposition schemes are employed to break an originally large problem into smaller ones and allow the possibility of parallel computing. (4) The solution space projection and the domain decomposition schemes are combined in a mutually beneficial manner which achieves an even more efficient full-wave analysis.","Item withdrawn by Mark Zulauf (zulauf@illinois.edu) on 2012-11-19T20:32:53Z Item was in collections: University of Illinois Theses & Dissertations (ID: 1) No. of bitstreams: 1 Lu_Tianjian.pdf: 908650 bytes, checksum: a5073ad3b2890caca1f7e4ee8737882f (MD5)","Made available in DSpace on 2013-02-03T19:16:11Z (GMT). No. of bitstreams: 2 Tianjian_Lu.pdf: 908650 bytes, checksum: a5073ad3b2890caca1f7e4ee8737882f (MD5) license.txt: 4057 bytes, checksum: 4200c57a139a544cb441cb31101fae01 (MD5)","Restriction data tranferred 2014-07-01T11:11:48-05:00 Original Data Group with Access UIUC Users [automated] Release Date: 2015-02-03 13:18:53 UTC Reason: Author requested U of Illinois access only (OA after 2yrs) in Vireo ETD system","Item marked as restricted to the 'UIUC Users [automated]' Group (id=2) by Seth Robbins (srobbins@illinois.edu) on 2013-02-03T19:18:53Z Item is restricted until 2015-02-03T19:18:53Z","U of I Only Restriction Lifted for Item 42066 on 2015-02-03T11:00:27Z."]},{"key":"dc:title","label":"Title","values":["Signal integrity analysis of high-speed multilayer interconnects using the finite element method"]}]}],"canonical_facts":{"dc:contributor":["Jin, Jianming"],"dc:creator":["Lu, Tianjian"],"dc:date":["2013-02-03T19:16:11Z","2015-02-03T11:00:27Z","2012-12"],"dc:description":["Approaches of modeling high-speed interconnect generally fall into two categories: circuit models based on circuit-parameter extractions and full-wave methods based on solving Maxwell's equations. Even though computationally efficient, the approaches based on circuit-parameter extractions fail to provide accurate predictions due to the increased coupling and radiation effects at high frequencies. This work targets the fast and efficient full-wave analysis of high-speed multilayer interconnects. To enhance the efficiency of the full-wave analysis, fast frequency sweep techniques and domain decomposition schemes are first investigated and then implemented. This work consists of four major parts. (1) The full-wave analysis is implemented based on the finite element method. The capability of handling arbitrary geometries of the finite element method is utilized to deal with complex circuit structures. (2) The efficiency of the full-wave method is enhanced for broadband characterization by the incorporation of the solution space projection. (3) Various domain decomposition schemes are employed to break an originally large problem into smaller ones and allow the possibility of parallel computing. (4) The solution space projection and the domain decomposition schemes are combined in a mutually beneficial manner which achieves an even more efficient full-wave analysis.","Item withdrawn by Mark Zulauf (zulauf@illinois.edu) on 2012-11-19T20:32:53Z Item was in collections: University of Illinois Theses & Dissertations (ID: 1) No. of bitstreams: 1 Lu_Tianjian.pdf: 908650 bytes, checksum: a5073ad3b2890caca1f7e4ee8737882f (MD5)","Made available in DSpace on 2013-02-03T19:16:11Z (GMT). No. of bitstreams: 2 Tianjian_Lu.pdf: 908650 bytes, checksum: a5073ad3b2890caca1f7e4ee8737882f (MD5) license.txt: 4057 bytes, checksum: 4200c57a139a544cb441cb31101fae01 (MD5)","Restriction data tranferred 2014-07-01T11:11:48-05:00 Original Data Group with Access UIUC Users [automated] Release Date: 2015-02-03 13:18:53 UTC Reason: Author requested U of Illinois access only (OA after 2yrs) in Vireo ETD system","Item marked as restricted to the 'UIUC Users [automated]' Group (id=2) by Seth Robbins (srobbins@illinois.edu) on 2013-02-03T19:18:53Z Item is restricted until 2015-02-03T19:18:53Z","U of I Only Restriction Lifted for Item 42066 on 2015-02-03T11:00:27Z."],"dc:identifier":["http://hdl.handle.net/2142/42119"],"dc:language":["en"],"dc:rights":["Copyright 2012 Tianjian Lu"],"dc:subject":["Signal Integrity","Multilayer Interconnects","Full-Wave Analysis","Finite Element Method","Fast Frequency Sweep","Domain Decomposition"],"dc:title":["Signal integrity analysis of high-speed multilayer interconnects using the finite element method"],"dc:type":["text"],"thesis:degree_discipline":["Electrical & Computer Engr"],"thesis:degree_level":["Thesis"],"thesis:degree_name":["M.S."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:25:31Z"}