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University of Illinois at Urbana-Champaign

Confinement of microplasma in silicon trenches with widths as small as 2.5 μm

Abstract

dc:description

In plasma science, the ability to confine plasma in cavities with characteristic dimensions less than 1 μm would represent a major milestone. In this thesis, realization of microplasma inside channel devices with the characteristic dimensions of 5 μm and 2.5 μm is discussed. Data collected during the characterization of 5 μm devices are consistent with Paschen’s curve. Operating devices with a characteristic dimension of 2.5 μm are also introduced in this thesis. Finally, a few potential strategies for creating “nanoplasma” devices are discussed.

Degree

thesis:*
Name thesis:degree_name
M.S.
Level thesis:degree_level
Thesis
Discipline thesis:degree_discipline
Electrical & Computer Engr
Grantor
University of Illinois at Urbana-Champaign
Year dc:date
2012

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Kim, Eung Soo
Contributors dc:contributor
  • Eden, James G.

Subjects

dc:subject × 4

Rights

dc:rights
Statement dc:rights
  • Copyright 2012 Eung Soo Kim
Language dc:language
en

Identifiers

dc:identifier.*
Handle dc:identifier
http://hdl.handle.net/2142/34514
OAI identifier oai:identifier
oai:www.ideals.illinois.edu:2142/34514

Chain of custody

source
Harvested from
University of Illinois - Urbana-Champaign
Base URL
www.ideals.illinois.edu/oai-pmh
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Kim, Eung Soo. Confinement of microplasma in silicon trenches with widths as small as 2.5 μm. Thesis thesis, University of Illinois at Urbana-Champaign, 2012. http://hdl.handle.net/2142/34514