University of Illinois at Urbana-Champaign
3D Electro-thermal Monte Carlo Study of Transport in confined Silicon Devices
Abstract
dc:descriptionThe simultaneous explosion of portable microelectronics devices and the rapid shrinking of microprocessor size have provided a tremendous motivation to scientists and engineers to continue the down-scaling of these devices. For several decades, innovations have allowed components such as transistors to be physically reduced in size, allowing the famous Moore's law to hold true. As these transistors approach the atomic scale, however, further reduction becomes less probable and practical. As new technologies overcome these limitations, they face new, unexpected problems, including the ability to accurately simulate and predict the behavior of these devices, and to manage the heat they generate. This work uses a 3D Monte Carlo (MC) simulator to investigate the electro-thermal behavior of quasi-one-dimensional electron gas (1DEG) multigate MOSFETs. In order to study these highly confined architectures, the inclusion of quantum correction becomes essential. To better capture the influence of carrier confinement, the electrostatically quantum-corrected full-band MC model has the added feature of being able to incorporate subband scattering. The scattering rate selection introduces quantum correction into carrier movement.
Degree
thesis:*- Name thesis:degree_name
- Ph.D.
- Level thesis:degree_level
- Dissertation
- Discipline thesis:degree_discipline
- Electrical & Computer Engr
- Grantor
- University of Illinois at Urbana-Champaign
- Year dc:date
- 2012
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Mohamed, Mohamed
- Contributors dc:contributor
-
- Ravaioli, Umberto
- Choquette, Kent D.
- Tucker, John R.
- Jain, Kanti
Subjects
dc:subject × 8Rights
dc:rights- Statement dc:rights
-
- Copyright 2012 Mohamed Mohamed
- Language dc:language
- en
Identifiers
dc:identifier.*- Handle dc:identifier
- http://hdl.handle.net/2142/31963
- OAI identifier oai:identifier
- oai:www.ideals.illinois.edu:2142/31963