Back to results
University of Illinois at Urbana-Champaign
Hierarchical electromigration reliability diagnosis for ULSI interconnects
Abstract
dc:descriptionElectromigration is the phenomenon of metal ion mass transport along the grain boundaries when a metallic interconnect is stressed under high current density. In recent years, the line width of ULSI interconnects has been shrunk into the submicron regime. This gives rise to serious concerns about electromigration-induced failures.
Degree
thesis:*- Name thesis:degree_name
- Ph.D.
- Level thesis:degree_level
- Dissertation
- Discipline thesis:degree_discipline
- Engineering, Electronics and Electrical
- Grantor
- University of Illinois at Urbana-Champaign
- Year dc:date
- 2011
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Teng, Chin-Chi
- Contributors dc:contributor
-
- Kang, Sung Mo
Subjects
dc:subject × 1Rights
dc:rights- Statement dc:rights
-
- Copyright 1996 Teng, Chin-Chi
- Language dc:language
- eng
Identifiers
dc:identifier.*- Identifier
-
9780591200133
AAI9712456
(UMI)AAI9712456 - OAI identifier oai:identifier
- oai:www.ideals.illinois.edu:2142/22614