Design automation and analysis of power distribution networks and chiplet-to-chiplet communication interfaces in 2.5D advanced packaging technologies

This thesis presents a comprehensive design automation workflow for modeling and analyzing the power distribution networks in 2.5D advanced packaging for heterogeneous integration applications. Challenges related to the routing schemes, 3D model construction time, and simulation complexity are identified, and temporary solutions are deliberated. Multiple test cases involving power distribution networks and high-speed via pairs are implemented with the automation workflow, and the results are analyzed. Finally, bunch of wires, an open source chiplet-to-chiplet interface, is introduced and the progress towards the design automation is discussed.

Name thesis:degree_name

M.S.

Level thesis:degree_level

Thesis

Discipline thesis:degree_discipline

Electrical & Computer Engr

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2023

Author dc:creator

• Sun, Haofeng

Contributors dc:contributor

• Schutt-Aine, Jose E

• Pdn
• Design Automation
• Hfss
• Bow

Statement dc:rights

• Copyright 2023 Haofeng Sun

Language dc:language

en, eng

Handle dc:identifier

https://hdl.handle.net/2142/122183

OAI record oai:identifier

https://www.ideals.illinois.edu/oai-pmh?verb=GetRecord&metadataPrefix=etdms&identifier=oai%3Awww.ideals.illinois.edu%3A2142%2F122183