{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/122183"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/122183","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Design automation and analysis of power distribution networks and chiplet-to-chiplet communication interfaces in 2.5D advanced packaging technologies","abstract":"Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2025-12-01","abstract_html":"Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2025-12-01","abstract_has_math":false,"creators":["Sun, Haofeng"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"M.S.","degree_level":"Thesis","degree_discipline":"Electrical & Computer Engr","degree_department":null,"school":null,"contributors":["Schutt-Aine, Jose E"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2023,"date_issued":"2023-12","date_published":"2023-12","updated_at":"2026-07-22T22:25:00Z","subjects":["Pdn","Design Automation","Hfss","Bow"],"languages":["en","eng"],"rights":["Copyright 2023 Haofeng Sun"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"https://hdl.handle.net/2142/122183","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Schutt-Aine, Jose E"]},{"key":"dc:creator","label":"Author","values":["Sun, Haofeng"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2023-12","2023-12-07"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Electrical & Computer Engr"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Thesis"]},{"key":"thesis:degree_name","label":"Degree Name","values":["M.S."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Pdn","Design Automation","Hfss","Bow"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en","eng"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2023 Haofeng Sun"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["https://hdl.handle.net/2142/122183"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2025-12-01","The student, Haofeng Sun, accepted the attached license on 2023-12-07 at 14:22.","The student, Haofeng Sun, submitted this Thesis for approval on 2023-12-07 at 14:30.","This Thesis was approved for publication on 2023-12-07 at 17:00.","DSpace SAF Submission Ingestion Package generated from Vireo submission #20169 on 2024-03-01 at 13:32:43","This thesis presents a comprehensive design automation workflow for modeling and analyzing the power distribution networks in 2.5D advanced packaging for heterogeneous integration applications. Challenges related to the routing schemes, 3D model construction time, and simulation complexity are identified, and temporary solutions are deliberated. Multiple test cases involving power distribution networks and high-speed via pairs are implemented with the automation workflow, and the results are analyzed. Finally, bunch of wires, an open source chiplet-to-chiplet interface, is introduced and the progress towards the design automation is discussed."]},{"key":"dc:format","label":"Dc Format","values":["application/pdf"]},{"key":"dc:title","label":"Title","values":["Design automation and analysis of power distribution networks and chiplet-to-chiplet communication interfaces in 2.5D advanced packaging technologies"]}]}],"canonical_facts":{"dc:contributor":["Schutt-Aine, Jose E"],"dc:creator":["Sun, Haofeng"],"dc:date":["2023-12","2023-12-07"],"dc:description":["Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2025-12-01","The student, Haofeng Sun, accepted the attached license on 2023-12-07 at 14:22.","The student, Haofeng Sun, submitted this Thesis for approval on 2023-12-07 at 14:30.","This Thesis was approved for publication on 2023-12-07 at 17:00.","DSpace SAF Submission Ingestion Package generated from Vireo submission #20169 on 2024-03-01 at 13:32:43","This thesis presents a comprehensive design automation workflow for modeling and analyzing the power distribution networks in 2.5D advanced packaging for heterogeneous integration applications. Challenges related to the routing schemes, 3D model construction time, and simulation complexity are identified, and temporary solutions are deliberated. Multiple test cases involving power distribution networks and high-speed via pairs are implemented with the automation workflow, and the results are analyzed. Finally, bunch of wires, an open source chiplet-to-chiplet interface, is introduced and the progress towards the design automation is discussed."],"dc:format":["application/pdf"],"dc:identifier":["https://hdl.handle.net/2142/122183"],"dc:language":["en","eng"],"dc:rights":["Copyright 2023 Haofeng Sun"],"dc:subject":["Pdn","Design Automation","Hfss","Bow"],"dc:title":["Design automation and analysis of power distribution networks and chiplet-to-chiplet communication interfaces in 2.5D advanced packaging technologies"],"dc:type":["text"],"thesis:degree_discipline":["Electrical & Computer Engr"],"thesis:degree_level":["Thesis"],"thesis:degree_name":["M.S."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:25:00Z"}