Subsurface 3D integrated photonic devices

In recent years, there has been tremendous interest in photonic integrated circuits (PICs) for various applications such as communications, computing, and sensing. However, much of the existing works leverage traditional planar silicon photonics with limited integration density. In principle, volumetric photonic integrated circuits (VPICs) based on two-photon polymerization (TPP) enable the ability to massively integrate micron scale photonic elements within the volume of a substrate wafer, as opposed to traditional planar silicon photonics. To this end, we demonstrate the ability to fabricate high performing passive photonic devices - Mach-Zehnder interferometers and microring resonators. In particular, we will discuss the physical theory and engineering aspects of these two VPIC devices, as well as their fabrication and testing results.

Name thesis:degree_name

M.S.

Level thesis:degree_level

Thesis

Discipline thesis:degree_discipline

Electrical & Computer Engr

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2023

Author dc:creator

• Huang, Jack

Contributors dc:contributor

• Goddard, Lynford L

• Integrated Photonics
• Photonics Integrated Circuits
• Mach-zehnder Interferometers
• Microring Resonators
• Two-photon Lithography

Statement dc:rights

• Copyright 2023 Jack Huang

Language dc:language

en, eng

Handle dc:identifier

https://hdl.handle.net/2142/120574

OAI record oai:identifier

https://www.ideals.illinois.edu/oai-pmh?verb=GetRecord&metadataPrefix=etdms&identifier=oai%3Awww.ideals.illinois.edu%3A2142%2F120574