{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/120574"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/120574","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Subsurface 3D integrated photonic devices","abstract":"Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2025-05-01","abstract_html":"Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2025-05-01","abstract_has_math":false,"creators":["Huang, Jack"],"institution":"University of Illinois at Urbana-Champaign","degree_name":"M.S.","degree_level":"Thesis","degree_discipline":"Electrical & Computer Engr","degree_department":null,"school":null,"contributors":["Goddard, Lynford L"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2023,"date_issued":"2023-05","date_published":"2023-05","updated_at":"2026-07-22T22:24:57Z","subjects":["Integrated Photonics","Photonics Integrated Circuits","Mach-zehnder Interferometers","Microring Resonators","Two-photon Lithography"],"languages":["en","eng"],"rights":["Copyright 2023 Jack Huang"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"https://hdl.handle.net/2142/120574","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Goddard, Lynford L"]},{"key":"dc:creator","label":"Author","values":["Huang, Jack"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2023-05","2023-05-01"]},{"key":"dc:type","label":"Dc Type","values":["text"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Electrical & Computer Engr"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Thesis"]},{"key":"thesis:degree_name","label":"Degree Name","values":["M.S."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Integrated Photonics","Photonics Integrated Circuits","Mach-zehnder Interferometers","Microring Resonators","Two-photon Lithography"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en","eng"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2023 Jack Huang"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["https://hdl.handle.net/2142/120574"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2025-05-01","The student, Jack Huang, accepted the attached license on 2023-04-28 at 14:37.","The student, Jack Huang, submitted this Thesis for approval on 2023-04-28 at 14:43.","This Thesis was approved for publication on 2023-05-01 at 13:45.","DSpace SAF Submission Ingestion Package generated from Vireo submission #19250 on 2023-09-01 at 17:22:10","In recent years, there has been tremendous interest in photonic integrated circuits (PICs) for various applications such as communications, computing, and sensing. However, much of the existing works leverage traditional planar silicon photonics with limited integration density. In principle, volumetric photonic integrated circuits (VPICs) based on two-photon polymerization (TPP) enable the ability to massively integrate micron scale photonic elements within the volume of a substrate wafer, as opposed to traditional planar silicon photonics. To this end, we demonstrate the ability to fabricate high performing passive photonic devices - Mach-Zehnder interferometers and microring resonators. In particular, we will discuss the physical theory and engineering aspects of these two VPIC devices, as well as their fabrication and testing results."]},{"key":"dc:format","label":"Dc Format","values":["application/pdf"]},{"key":"dc:title","label":"Title","values":["Subsurface 3D integrated photonic devices"]}]}],"canonical_facts":{"dc:contributor":["Goddard, Lynford L"],"dc:creator":["Huang, Jack"],"dc:date":["2023-05","2023-05-01"],"dc:description":["Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2025-05-01","The student, Jack Huang, accepted the attached license on 2023-04-28 at 14:37.","The student, Jack Huang, submitted this Thesis for approval on 2023-04-28 at 14:43.","This Thesis was approved for publication on 2023-05-01 at 13:45.","DSpace SAF Submission Ingestion Package generated from Vireo submission #19250 on 2023-09-01 at 17:22:10","In recent years, there has been tremendous interest in photonic integrated circuits (PICs) for various applications such as communications, computing, and sensing. However, much of the existing works leverage traditional planar silicon photonics with limited integration density. In principle, volumetric photonic integrated circuits (VPICs) based on two-photon polymerization (TPP) enable the ability to massively integrate micron scale photonic elements within the volume of a substrate wafer, as opposed to traditional planar silicon photonics. To this end, we demonstrate the ability to fabricate high performing passive photonic devices - Mach-Zehnder interferometers and microring resonators. In particular, we will discuss the physical theory and engineering aspects of these two VPIC devices, as well as their fabrication and testing results."],"dc:format":["application/pdf"],"dc:identifier":["https://hdl.handle.net/2142/120574"],"dc:language":["en","eng"],"dc:rights":["Copyright 2023 Jack Huang"],"dc:subject":["Integrated Photonics","Photonics Integrated Circuits","Mach-zehnder Interferometers","Microring Resonators","Two-photon Lithography"],"dc:title":["Subsurface 3D integrated photonic devices"],"dc:type":["text"],"thesis:degree_discipline":["Electrical & Computer Engr"],"thesis:degree_level":["Thesis"],"thesis:degree_name":["M.S."],"thesis:institution_name":["University of Illinois at Urbana-Champaign"]},"updated_at":"2026-07-22T22:24:57Z"}