Scalable and durable macro-micro-nanomanufacturing of functional interfaces and devices

Around 70% of global electricity is produced from steam-cycle power plants. Utilizing a hydrophobic condenser surface within the steam cycle has potential to enhance the overall cycle efficiency by up to 2%, demonstrating a profound impact on the global energy landscape as well as on carbon footprint. Moreover, past research has shown that mixed-liquid repellency (hybrid wettability) of condenser surface can significantly enhance the condenser performance. However, main challenges are scalable fabrication of mixed hydrophobicity or hybrid/ biphilic surfaces, and lack of durability of the hydrophobic promoters. Also, traditional hydrophobic chemistry is not suitable in many applications (organic Rankine cycles) where low surface tension liquids are used, alternatives are proposed with limited focus on durability improvement. Here, we develop a simple, scalable, rapid stamping method for hybrid surface fabrication which is substrate and coating independent. From fundamental physics-based understanding of hydrophobic layer degradation mechanism, we develop a robust hydrophobic coating for steam condensation, which has outstanding mechanical and thermal properties that enable durability in moist (> 3 years condensation), abrasive (> 5000 cycles), and high temperature (> 300°C) environments. For condenser surface where low surface tension liquids are used, we demonstrate design methods and longevity statistics and develop fundamental design guidelines for creating durable hydrophobic surfaces. In contrast to generation, the electric energy from power plant is used in all electronic devices and rapid miniaturization of electronics had led to significant growth in the power density of modern devices and systems, which demands effective thermal management to avoid unwanted failure due to overheating. Here, by adapting device level macro-machining and additive manufacturing we develop advanced thermal solutions for both air and liquid cooled electronics for different mobile applications. Our developed air cooled (modular heat sink) and liquid cooled (polymer-metal hybrid cold plate) based advanced thermal solutions offer system level volumetric and gravimetric power density enhancement, also improve the system reliability by enabling isothermalization of devices. The techniques and insights presented here will open new avenue of research to adapt advanced multiscale manufacturing to improve the performance of different energy systems.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Mechanical Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2022

Author dc:creator

• Hoque, Muhammad Jahidul

Contributors dc:contributor

• Miljkovic, Nenad
• Jacobi, Anthony
• Ferreira, Placid
• Alleyne, Marianne

• Biphilic surface
• Diamond Like Carbon
• SLIPS
• Heat Sink
• Cold plate

Statement dc:rights

• © 2022 Muhammad Jahidul Hoque

Language dc:language

en, eng

Handle dc:identifier

https://hdl.handle.net/2142/115589

OAI record oai:identifier

https://www.ideals.illinois.edu/oai-pmh?verb=GetRecord&metadataPrefix=etdms&identifier=oai%3Awww.ideals.illinois.edu%3A2142%2F115589