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University of Illinois at Urbana-Champaign

Tin etching in an EUV source by inherent and surface wave plasma

Abstract

dc:description

Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2022-11-11 without embargo terms

Degree

thesis:*
Name thesis:degree_name
Ph.D.
Level thesis:degree_level
Dissertation
Discipline thesis:degree_discipline
Nuclear, Plasma, Radiolgc Engr
Grantor
University of Illinois at Urbana-Champaign
Year dc:date
2022

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Qerimi, Dren
Contributors dc:contributor
  • Ruzic, David N.
  • Curreli, Davide
  • Jurczyk, Brian
  • Rovey, Joshua L.

Subjects

dc:subject × 8

Rights

dc:rights
Statement dc:rights
  • Copyright 2022 Dren Qerimi
Language dc:language
en, eng

Identifiers

dc:identifier.*
Handle dc:identifier
https://hdl.handle.net/2142/115451
OAI identifier oai:identifier
oai:www.ideals.illinois.edu:2142/115451

Chain of custody

source
Harvested from
University of Illinois - Urbana-Champaign
Base URL
www.ideals.illinois.edu/oai-pmh
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Qerimi, Dren. Tin etching in an EUV source by inherent and surface wave plasma. Dissertation thesis, University of Illinois at Urbana-Champaign, 2022. https://hdl.handle.net/2142/115451