Interfacial adhesion of thin film high energy density anode materials

Future energy storage needs are rapidly moving beyond the capabilities of current Li-ion battery technologies. The demand for greater energy density, performance, and longevity has led to the development of numerous three-dimensional (3D) structured anodes that can leverage the incredible Li storage capacity of silicon. A common feature among many 3D structured anodes is the use of a nickel (Ni) current collector scaffold coated with amorphous silicon (a-Si) active material. Despite the importance of a-Si remaining adhered to the Ni scaffold during cycling, little work has been done to study the interface strength of Ni/a-Si systems. Here, we investigate Ni/a-Si interfacial adhesion strength through the technique of laser spallation (LS) combined with finite element analysis (FEA). It was found that the Ni/a-Si interface can withstand at least ~250 MPa in tension before failure is initiated. Tests at higher stress levels were inconclusive due to consistent failure of the sample at the substrate/a-Si interface rather than the Ni/a-Si interface. Results also showed that the adhesion strength of Ni/a-Si was much weaker when a-Si was deposited by chemical vapor deposition (CVD) rather than electron-beam (e-beam) evaporation. This study brings insight to the durability Ni/a-Si structured anodes and will prove valuable in the design of future battery technologies.

Name thesis:degree_name

M.S.

Level thesis:degree_level

Thesis

Discipline thesis:degree_discipline

Materials Science and Engineering

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2021

Author dc:creator

• Diamond, Jacob M.

Contributors dc:contributor

• Sottos, Nancy R.

• Thin Films
• Adhesion
• Structured Anodes
• Laser Spallation

Statement dc:rights

• Copyright 2020 Jacob Diamond

Language dc:language

en

Handle dc:identifier

http://hdl.handle.net/2142/109483

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/109483