{"id":{"repo_id":"uiuc","oai_identifier":"oai:www.ideals.illinois.edu:2142/109483"},"canonical_url":"https://search.dev.ndltd.org/etd/uiuc/oai:www.ideals.illinois.edu:2142/109483","repository":{"repo_id":"uiuc","name":"University of Illinois - Urbana-Champaign","base_url":"https://www.ideals.illinois.edu/oai-pmh"},"display":{"title":"Interfacial adhesion of thin film high energy density anode materials","abstract":"Future energy storage needs are rapidly moving beyond the capabilities of current Li-ion battery technologies. The demand for greater energy density, performance, and longevity has led to the development of numerous three-dimensional (3D) structured anodes that can leverage the incredible Li storage capacity of silicon. A common feature among many 3D structured anodes is the use of a nickel (Ni) current collector scaffold coated with amorphous silicon (a-Si) active material. Despite the importance of a-Si remaining adhered to the Ni scaffold during cycling, little work has been done to study the interface strength of Ni/a-Si systems. Here, we investigate Ni/a-Si interfacial adhesion strength through the technique of laser spallation (LS) combined with finite element analysis (FEA). It was found that the Ni/a-Si interface can withstand at least ~250 MPa in tension before failure is initiated. Tests at higher stress levels were inconclusive due to consistent failure of the sample at the substrate/a-Si interface rather than the Ni/a-Si interface. Results also showed that the adhesion strength of Ni/a-Si was much weaker when a-Si was deposited by chemical vapor deposition (CVD) rather than electron-beam (e-beam) evaporation. This study brings insight to the durability Ni/a-Si structured anodes and will prove valuable in the design of future battery technologies.","abstract_html":"Future energy storage needs are rapidly moving beyond the capabilities of current Li-ion battery technologies. The demand for greater energy density, performance, and longevity has led to the development of numerous three-dimensional (3D) structured anodes that can leverage the incredible Li storage capacity of silicon. A common feature among many 3D structured anodes is the use of a nickel (Ni) current collector scaffold coated with amorphous silicon (a-Si) active material. Despite the importance of a-Si remaining adhered to the Ni scaffold during cycling, little work has been done to study the interface strength of Ni/a-Si systems. Here, we investigate Ni/a-Si interfacial adhesion strength through the technique of laser spallation (LS) combined with finite element analysis (FEA). It was found that the Ni/a-Si interface can withstand at least ~250 MPa in tension before failure is initiated. Tests at higher stress levels were inconclusive due to consistent failure of the sample at the substrate/a-Si interface rather than the Ni/a-Si interface. Results also showed that the adhesion strength of Ni/a-Si was much weaker when a-Si was deposited by chemical vapor deposition (CVD) rather than electron-beam (e-beam) evaporation. This study brings insight to the durability Ni/a-Si structured anodes and will prove valuable in the design of future battery technologies.","abstract_has_math":false,"creators":["Diamond, Jacob M."],"institution":"University of Illinois at Urbana-Champaign","degree_name":"M.S.","degree_level":"Thesis","degree_discipline":"Materials Science and Engineering","degree_department":null,"school":null,"contributors":["Sottos, Nancy R."],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2021,"date_issued":"2021-03-05T21:40:40Z","date_published":"2021-03-05T21:40:40Z","updated_at":"2026-07-22T22:24:50Z","subjects":["Thin Films","Adhesion","Structured Anodes","Laser Spallation"],"languages":["en"],"rights":["Copyright 2020 Jacob Diamond"],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/2142/109483","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Sottos, Nancy R."]},{"key":"dc:creator","label":"Author","values":["Diamond, Jacob M."]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2021-03-05T21:40:40Z","2023-03-05T21:43:00Z","2020-10-21","2020-12"]},{"key":"dc:type","label":"Dc Type","values":["text","Thesis"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Materials Science and Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Thesis"]},{"key":"thesis:degree_name","label":"Degree Name","values":["M.S."]},{"key":"thesis:institution_name","label":"Thesis Institution Name","values":["University of Illinois at Urbana-Champaign"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Thin Films","Adhesion","Structured Anodes","Laser Spallation"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright 2020 Jacob Diamond"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/2142/109483"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Future energy storage needs are rapidly moving beyond the capabilities of current Li-ion battery technologies. The demand for greater energy density, performance, and longevity has led to the development of numerous three-dimensional (3D) structured anodes that can leverage the incredible Li storage capacity of silicon. A common feature among many 3D structured anodes is the use of a nickel (Ni) current collector scaffold coated with amorphous silicon (a-Si) active material. Despite the importance of a-Si remaining adhered to the Ni scaffold during cycling, little work has been done to study the interface strength of Ni/a-Si systems. Here, we investigate Ni/a-Si interfacial adhesion strength through the technique of laser spallation (LS) combined with finite element analysis (FEA). It was found that the Ni/a-Si interface can withstand at least ~250 MPa in tension before failure is initiated. Tests at higher stress levels were inconclusive due to consistent failure of the sample at the substrate/a-Si interface rather than the Ni/a-Si interface. Results also showed that the adhesion strength of Ni/a-Si was much weaker when a-Si was deposited by chemical vapor deposition (CVD) rather than electron-beam (e-beam) evaporation. This study brings insight to the durability Ni/a-Si structured anodes and will prove valuable in the design of future battery technologies.","Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2022-12-01","The student, Jacob Diamond, accepted the attached license on 2020-10-16 at 11:05.","The student, Jacob Diamond, submitted this Thesis for approval on 2020-10-16 at 11:15.","This Thesis was approved for publication on 2020-10-21 at 08:48.","DSpace SAF Submission Ingestion Package generated from Vireo submission #15837 on 2021-03-04 at 16:19:21","Made available in DSpace on 2021-03-05T21:40:40Z (GMT). No. of bitstreams: 2 DIAMOND-THESIS-2020.pdf: 1536376 bytes, checksum: 43600d62d36a3db4993ccd24cd1a96f0 (MD5) LICENSE.txt: 4210 bytes, checksum: c0c7840eebb7a148122e103a327df5e5 (MD5) Previous issue date: 2020-10-21","Embargo set by: Seth Robbins for item 117187 Lift date: 2023-03-05T21:40:52Z Reason: Author requested U of Illinois access only (OA after 2yrs) in Vireo ETD system","Embargo set by: Seth Robbins for item 117187 Lift date: 2023-03-05T21:43:00Z Reason: Author requested U of Illinois access only (OA after 2yrs) in Vireo ETD system","Author requested U of Illinois access only (OA after 2yrs) in Vireo ETD system","U of I Only"]},{"key":"dc:format","label":"Dc Format","values":["application/pdf"]},{"key":"dc:title","label":"Title","values":["Interfacial adhesion of thin film high energy density anode materials"]}]}],"canonical_facts":{"dc:contributor":["Sottos, Nancy R."],"dc:creator":["Diamond, Jacob M."],"dc:date":["2021-03-05T21:40:40Z","2023-03-05T21:43:00Z","2020-10-21","2020-12"],"dc:description":["Future energy storage needs are rapidly moving beyond the capabilities of current Li-ion battery technologies. The demand for greater energy density, performance, and longevity has led to the development of numerous three-dimensional (3D) structured anodes that can leverage the incredible Li storage capacity of silicon. A common feature among many 3D structured anodes is the use of a nickel (Ni) current collector scaffold coated with amorphous silicon (a-Si) active material. Despite the importance of a-Si remaining adhered to the Ni scaffold during cycling, little work has been done to study the interface strength of Ni/a-Si systems. Here, we investigate Ni/a-Si interfacial adhesion strength through the technique of laser spallation (LS) combined with finite element analysis (FEA). It was found that the Ni/a-Si interface can withstand at least ~250 MPa in tension before failure is initiated. Tests at higher stress levels were inconclusive due to consistent failure of the sample at the substrate/a-Si interface rather than the Ni/a-Si interface. Results also showed that the adhesion strength of Ni/a-Si was much weaker when a-Si was deposited by chemical vapor deposition (CVD) rather than electron-beam (e-beam) evaporation. This study brings insight to the durability Ni/a-Si structured anodes and will prove valuable in the design of future battery technologies.","Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2022-12-01","The student, Jacob Diamond, accepted the attached license on 2020-10-16 at 11:05.","The student, Jacob Diamond, submitted this Thesis for approval on 2020-10-16 at 11:15.","This Thesis was approved for publication on 2020-10-21 at 08:48.","DSpace SAF Submission Ingestion Package generated from Vireo submission #15837 on 2021-03-04 at 16:19:21","Made available in DSpace on 2021-03-05T21:40:40Z (GMT). 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