Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects

The past decade has seen a new manufacturing revolution, in the form of additive manufacturing. While recent additive manufacturing processes can produce structural materials in intricate shapes not previously possible, additive manufacturing of functional materials remains a challenge. In particular, functional electronics must still be made via traditional lithographic and etching processes. This thesis introduces a microsputtering method to directly write metals with high resolution. A wire feed enables continuous, extended use of the system. We motivate, simulate, and test a novel electrostatic focusing system to improve the resolution of the imprints; this focusing scheme combines electrostatic and fluid effects to direct the sputtered material into a strip as narrow as 9 pm. The microstructure of the deposits, which affects their conductivity, is also explored and modified. Using gold as printable feedstock, this technology allows for smooth (55 nm roughness) deposits with ~65X the electrical conductivity of bulk metal.

Department dc:contributor.department

Massachusetts Institute of Technology. Department of Mechanical Engineering

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2018

Author dc:creator

• Kornbluth, Yosef S. (Yosef Shimshon)

Advisor dc:contributor.advisor

• Luis Fernando Velásuez-García

• Mechanical Engineering.

Statement dc:rights

• MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/118707

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/118707