{"id":{"repo_id":"mit","oai_identifier":"oai:dspace.mit.edu:1721.1/118707"},"canonical_url":"https://search.dev.ndltd.org/etd/mit/oai:dspace.mit.edu:1721.1/118707","repository":{"repo_id":"mit","name":"MIT","base_url":"https://dspace.mit.edu/oai/request"},"display":{"title":"Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects","abstract":"The past decade has seen a new manufacturing revolution, in the form of additive manufacturing. While recent additive manufacturing processes can produce structural materials in intricate shapes not previously possible, additive manufacturing of functional materials remains a challenge. In particular, functional electronics must still be made via traditional lithographic and etching processes. This thesis introduces a microsputtering method to directly write metals with high resolution. A wire feed enables continuous, extended use of the system. We motivate, simulate, and test a novel electrostatic focusing system to improve the resolution of the imprints; this focusing scheme combines electrostatic and fluid effects to direct the sputtered material into a strip as narrow as 9 pm. The microstructure of the deposits, which affects their conductivity, is also explored and modified. Using gold as printable feedstock, this technology allows for smooth (55 nm roughness) deposits with ~65X the electrical conductivity of bulk metal.","abstract_html":"The past decade has seen a new manufacturing revolution, in the form of additive manufacturing. While recent additive manufacturing processes can produce structural materials in intricate shapes not previously possible, additive manufacturing of functional materials remains a challenge. In particular, functional electronics must still be made via traditional lithographic and etching processes. This thesis introduces a microsputtering method to directly write metals with high resolution. A wire feed enables continuous, extended use of the system. We motivate, simulate, and test a novel electrostatic focusing system to improve the resolution of the imprints; this focusing scheme combines electrostatic and fluid effects to direct the sputtered material into a strip as narrow as 9 pm. The microstructure of the deposits, which affects their conductivity, is also explored and modified. Using gold as printable feedstock, this technology allows for smooth (55 nm roughness) deposits with ~65X the electrical conductivity of bulk metal.","abstract_has_math":false,"creators":["Kornbluth, Yosef S. (Yosef Shimshon)"],"institution":"Massachusetts Institute of Technology","degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":"Massachusetts Institute of Technology. Department of Mechanical Engineering","school":null,"contributors":[],"advisors":["Luis Fernando Velásuez-García"],"committee_chairs":[],"committee_members":[],"year":2018,"date_issued":"2018","date_published":"2018","updated_at":"2026-07-22T22:22:04Z","subjects":["Mechanical Engineering."],"languages":["eng"],"rights":["MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission."],"rights_urls":["http://dspace.mit.edu/handle/1721.1/7582"],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/1721.1/118707","outbound_label":"Handle","outbound_source":"dc:identifier.uri"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor.advisor","label":"Advisor","values":["Luis Fernando Velásuez-García"]},{"key":"dc:contributor.department","label":"Department","values":["Massachusetts Institute of Technology. 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While recent additive manufacturing processes can produce structural materials in intricate shapes not previously possible, additive manufacturing of functional materials remains a challenge. In particular, functional electronics must still be made via traditional lithographic and etching processes. This thesis introduces a microsputtering method to directly write metals with high resolution. A wire feed enables continuous, extended use of the system. We motivate, simulate, and test a novel electrostatic focusing system to improve the resolution of the imprints; this focusing scheme combines electrostatic and fluid effects to direct the sputtered material into a strip as narrow as 9 pm. The microstructure of the deposits, which affects their conductivity, is also explored and modified. Using gold as printable feedstock, this technology allows for smooth (55 nm roughness) deposits with ~65X the electrical conductivity of bulk metal."]},{"key":"dc:description.degree","label":"Dc Description Degree","values":["S.M."]},{"key":"dc:title","label":"Title","values":["Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects"]}]}],"canonical_facts":{"dc:contributor.advisor":["Luis Fernando Velásuez-García"],"dc:contributor.department":["Massachusetts Institute of Technology. Department of Mechanical Engineering"],"dc:contributor.other":["Massachusetts Institute of Technology. Department of Mechanical Engineering."],"dc:creator":["Kornbluth, Yosef S. 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We motivate, simulate, and test a novel electrostatic focusing system to improve the resolution of the imprints; this focusing scheme combines electrostatic and fluid effects to direct the sputtered material into a strip as narrow as 9 pm. The microstructure of the deposits, which affects their conductivity, is also explored and modified. Using gold as printable feedstock, this technology allows for smooth (55 nm roughness) deposits with ~65X the electrical conductivity of bulk metal."],"dc:description.degree":["S.M."],"dc:identifier.uri":["http://hdl.handle.net/1721.1/118707"],"dc:language.iso":["eng"],"dc:publisher":["Massachusetts Institute of Technology"],"dc:rights":["MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission."],"dc:rights.uri":["http://dspace.mit.edu/handle/1721.1/7582"],"dc:subject":["Mechanical Engineering."],"dc:title":["Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects"],"dc:type":["Thesis"]},"updated_at":"2026-07-22T22:22:04Z"}