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Showing 1 to 20 of 297 for “"Microelectronics"”.

  1. Diffusional Phenomena in Microelectronics Processing

    For surface diffusion, second ham-ionic microscopy has been utilized to quantify the Arrhenius parameters for diffusion of germanium on silicon at high temperatures. Molecular dynamics simulations provide insight on a picosecond timescale into the complex nature of the mass transfer diffusive …

    uiuc Repository record for Diffusional Phenomena in Microelectronics Processing (opens in a new tab)

  2. Thermal modeling of hybrid microelectronics

    As the size of hybrid microelectronics is reduced, the power density increases and thermal interaction between heat-producing devices becomes significant. A nondimensional model is developed to investigate the effects of heat source interaction on a substrate. The results predict the maximum …

    vt Repository record for Thermal modeling of hybrid microelectronics (opens in a new tab)

  3. Computer simulation of electromigration in microelectronics interconnect

    Electromigration (EM) is a phenomenon that occurs in metal conductor carrying high density electric current. EM causes voids and hillocks that may lead to open or short circuits in electronic devices. Avoiding these failures therefore is a major challenge in semiconductor device and packaging …

    greenwich Repository record for Computer simulation of electromigration in microelectronics interconnect (opens in a new tab)

  4. Computation of parasitics in multilayer hybrid microelectronics

    Layout parasitics result from electromagnetic interaction between circuit metalizations used to connect devices on the hybrid circuit. Three linked programs have been written to calculate the capacitance and inductance between circuit metalizations. (1) XT Editor A user friendly hybrid circuit …

    vt Repository record for Computation of parasitics in multilayer hybrid microelectronics (opens in a new tab)

  5. Optimisation modelling for microelectronics packaging and product design

    … and automated design approach for wide range microelectronics applications. The proposed methodology will also benefit from multi-physics numerical analysis to predict complex behaviour of electronic packages, systems and processes subject to different operational or environmental conditions. …

    greenwich Repository record for Optimisation modelling for microelectronics packaging and product design (opens in a new tab)

  6. MIT integrated microelectronics device experimentation and simulation iLab

    We developed the MIT Integrated Microelectronics Device Experimentation and Simulation iLab, a new online laboratory that combines and significantly upgrades the capabilities of two existing online microelectronics labs: WebLab, a device characterization lab, and WebLabSim, a device simulation lab. …

    mit Repository record for MIT integrated microelectronics device experimentation and simulation iLab (opens in a new tab)

  7. STUDY AND CHARACTERIZATION OF INNOVATIVE CLEANING METHODS IN MICROELECTRONICS

    … namely the BCD8, a BCD technology owned by STMicroelectronics, which has such a great influence in semiconductor industry that it received an IEEE Milestone. In particular, consequences that an innovative process such as HF/HCl can induce on a critical interface such as Si/gate oxide have been …

    catania Repository record for STUDY AND CHARACTERIZATION OF INNOVATIVE CLEANING METHODS IN MICROELECTRONICS (opens in a new tab)

  8. High Frequency Behaviour of Magnetic Thin Film Elements for Microelectronics

    Magnetismus ist ein Phänomen, das eine wichtige Rolle in einer Vielfalt technischer Anwendungen spielt. Ohne den Einsatz magnetischer Effekte und Materialen wäre der heutzutage erreichte technische Fortschritt unmöglich, da viele grundlegende Techniken wie Stromerzeugung, elektrischer Antrieb, …

    qucosa-diss

  9. Team discourse of middle school girls in collaborative microelectronics lessons

    Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2025-10-19 without embargo terms

    uiuc Repository record for Team discourse of middle school girls in collaborative microelectronics lessons (opens in a new tab)

  10. Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects

    The past decade has seen a new manufacturing revolution, in the form of additive manufacturing. While recent additive manufacturing processes can produce structural materials in intricate shapes not previously possible, additive manufacturing of functional materials remains a challenge. In …

    mit Repository record for Focused atmospheric-pressure microsputterer for additive manufacturing of microelectronics interconnects (opens in a new tab)

  11. Optimization of kitting operations for an automated microelectronics assembly process

    Raytheon's Solid-State Microwave (SSM) manufacturing area produces a low-volume, high mix assortment of Microwave Integrated Circuits (MIC) for airborne radars. The current kitting process for pick-and-place assembly is manually-intensive with significant die handling, resulting in multiple …

    mit Repository record for Optimization of kitting operations for an automated microelectronics assembly process (opens in a new tab)

  12. THE USE OF PECVD SILICON OXYNITRIDE THIN-FILMS IN MICROELECTRONICS MANUFACTURING

    In the semiconductor manufacturing, the high level of reflection from the substrates becomes intolerable in sub-0.25-llm optical lithography by using KrF excimer laser stepper. Linewidth variation and notching are commonly observed during microlithographic masking. Consequently, unacceptable …

    nus Repository record for THE USE OF PECVD SILICON OXYNITRIDE THIN-FILMS IN MICROELECTRONICS MANUFACTURING (opens in a new tab)

  13. GaAsP/InGaP heterojunction bipolar transistors for III-V on Si microelectronics

    … (HBTs) grown via MOCVD as a test-bed for III-V microelectronics integration with Si. Epitaxial challenges involving growth of GaAsP/InGaP HBT structures on Si substrates were addressed. Heavy C p-type doping of GaAsP via MOCVD, necessary for the HBT base region, was studied. Growth rate, …

    mit Repository record for GaAsP/InGaP heterojunction bipolar transistors for III-V on Si microelectronics (opens in a new tab)

  14. A thermal analysis tool for three-dimensional models of multilayer microelectronics

    This work details a computer-based modeling tool for predicting temperatures in three-dimensional multilayer microelectronic packages. It is capable of modeling surface connections (e.g., wire bonds and pins), edge connections (e.g., leads), and thermal vias. A three-dimensional control-volume …

    vt Repository record for A thermal analysis tool for three-dimensional models of multilayer microelectronics (opens in a new tab)

  15. A collaboration system and a graphical interface for the MIT Microelectronics WebLab

    Thesis (M.Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2002.

    mit Repository record for A collaboration system and a graphical interface for the MIT Microelectronics WebLab (opens in a new tab)

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