Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 20 of 46 for “"Power Modules"”.
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Reduction of Switching Losses in IGBT Power Modules
Lo scopo di questo lavoro è quello di studiare diverse strategie di ottimizzazione per pilotare IGBT e proporre una nuova tecnica. In applicazioni di potenza una particolare attenzione deve essere posta per fenomeni come le perdite di commutazione , sovracorrenti in accensione e sovratensione allo …
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Low Pressure and Short-Time Silver-Sintering for Power Modules
… technologies in wide bandgap (WBG) semiconductor power modules due to its excellent thermal conductivity, high temperature stability and mechanical reliability. However, the traditional silver sintering process generally has the problems of long sintering time and high auxiliary pressure, which …
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Evaluation of Active Capacitor Banks for Floating H-bridge Power Modules
The DC-side floating capacitors in the floating power modules of power converters are subject to high voltage fluctuation, due to the presence of reactive harmonic components. Utilizing passive capacitors, as done in traditional methods, helps reduce the DC-bus voltage ripple but makes the system …
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Cleaning process development and optimization in the surface mount assembly line of power modules
… process in the surface mount assembly line of power modules had been found to insufficiently remove solder flux residue from printed circuit board (PCB) assemblies after the process of reflow soldering. This thesis details the development of an optimized cleaning process that effectively …
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Field-Grading in Medium-Voltage Power Modules Using a Nonlinear Resistive Polymer Nanocomposite Coating
Medium-voltage silicon carbide power devices, due to their higher operational temperature, higher blocking voltage, and faster switching speed, promise transformative possibilities for power electronics in grid-tied applications, thereby fostering a more sustainable, resilient, and reliable …
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Reduced order modelling and numerical optimisation approach to reliability analysis of microsystems and power modules
… study detailed in this thesis is related to a power electronics IGBT structure and demonstrates the technology for predicting the reliability and robustness of a wirebond interconnect structure that is subjected to electro-thermo-mechanical loads. The design variables investigated in this study …
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Root cause analysis of solder flux residue incidence in the manufacture of electronic power modules
… electronic components in the manufacture of power modules. The existing deionized water-based centrifugal cleaning process was analyzed and hypotheses for root causes of the problem were proposed. The experimentation included cleaning tests using agitation and soak cycles. Parameters such as …
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Fabrication Refinements of Advanced Packaging Techniques for Medium-Voltage Wirebond-less Multi-Chip Power Modules
Three growing power electronics applications have massive requirements for properly operating their medium-voltage and high-voltage systems: electric transportation, renewable energy, and the power grid. Their needs include dense power systems with higher efficiency and higher voltage and current …
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Reliability Evaluation of Large-Area Sintered Direct Bonded Aluminum Substrates for Medium-Voltage Power Modules
… and evaluation of medium voltage (MV) power module packages. Specific focus will be given to the utilization of silver sintering as a bonding method for high temperature, high density power modules. Nano-silver paste and preform will be examined in detail as enabling technologies for a …
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The Development of Novel Interconnection Technologies for 3D Packaging of Wire Bondless Silicon Carbide Power Modules
… 3D packaging and integration of silicon carbide power modules. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power packaging. Current efforts pursuing 3D wire …
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Electric Field Grading and Electrical Insulation Design for High Voltage, High Power Density Wide Bandgap Power Modules
… electrical demand. Increases in electrical power demand can be provided by either higher currents or higher voltages. Due to "weight" and "voltage" drop, a raise in the current is not preferred; so, "higher voltages" are being considered. Another trend is to reduce the size and weight of …
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Design, Analysis and Experimental Verification of a Mechanically Compliant Interface for Fabricating Reliable, Double-Side Cooled, High Temperature, Sintered Silver Interconnected Power Modules
This research developed a double-side power electronics packaging scheme for high temperature applications exemplified by 1200 V, 150 A silicon devices. The power modules, based on both quarter and half-bridge topologies, were assembled using sintered silver device attachment rather than …
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Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules
… need for the introduction of high reliability power electronics in converting the raw form of electricity into efficient electricity for these applications is uprising. One of the most common failures in power electronics is temperature related failure such as overheating. To address the issue …
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Nonlinear Polymer Nanocomposite for Field Grading in Medium-Voltage Power Converters under High-Altitude and Humid Environments
… to enhance insulation within medium-voltage (MV) power modules and suppress flashover on printed-circuit boards (PCBs) at high altitudes. Electric field simulations of the triple-point (TP) region revealed strong E-field intensification at conductor-ceramic-silicone and conductor-FR4-air …
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Thermal Analysis, Parasitic Extraction, and Wirebond Reliability Studies of Power Electronic Modules
… and wirebond/encapsulation reliability of power electronic modules. Thermal performance is critical to the power electronic modules. As such, thermal analysis is an important part of the power electronic module design process. Several cases are studied on generalized power modules with a …
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PCB Busbar Design and Verification for a Multiphase SiC-based All-electric Aircraft Powertrain Converter
… SPI communication to drive the wide bandgap SiC power modules. With feature of drain-to-source current sensing feature, the gate driver could also provide over-current protection to fast-switching SiC power modules. The converter level verification is performed under single, dual, and quadruple …
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A Low Temperature Co-fired Ceramic (LTCC) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module
… module-level 3-D wire bondless stacked power module. As part of the dissertation work, the 3-D wire bondless stack is designed, simulated, fabricated and characterized. The 3-D wire bondless stack is realized with two stand-alone power modules in a half-bridge configuration. Each …
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Design of a 350 kW Silicon Carbide Based 3-phase Inverter with Ultra-Low Parasitic Inductance
… a design for a low parasitic inductance, high power density 3-phase inverter using silicon-carbide power modules for traction application in the electric vehicles with a power rating of 350 kW. With the market share of electric vehicles continuing to grow, there is a great opportunity for wide …
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Degradation modes of the top-side contacting of SiC power semiconductors
… interconnection technologies in silicon carbide power modules, specifically focusing on top-side interconnections using aluminum and copper bond wires. Driven by the increasing demand for robust and high-performance silicon carbide modules for applications in electric mobility and power …
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Planar metallization failure modes in integrated power electtonics modules
Miniaturizing circuit size and increasing power density are the latest trends in modern power electronics development. In order to meet the requirements of higher frequency and higher power density in power electronics applications, planar interconnections are utilized to achieve a higher …
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