Cleaning process development and optimization in the surface mount assembly line of power modules

The cleaning process in the surface mount assembly line of power modules had been found to insufficiently remove solder flux residue from printed circuit board (PCB) assemblies after the process of reflow soldering. This thesis details the development of an optimized cleaning process that effectively removes solder flux residue from PCB assemblies. The first stage of this study involves the experimental validation of root cause of process ineffectiveness. A novel visual inspection based grading scale is developed to quantify the amount of residue present. Using the grading scale optimal process parameters were identified and studied. The study finds that power modules are most effectively cleaned in a saponifier based cleaning solution using ultrasonic agitation. Power modules are completely cleaned when washed in an ultrasonic bath at 60°C for 7 minutes, in a saponifier based cleaning solution that is 5% concentration by volume.

Department dc:contributor.department

Massachusetts Institute of Technology. Dept. of Mechanical Engineering.

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2011

Author dc:creator

• Mukherjee, Ishan

Advisor dc:contributor.advisor

• Jung Hoon Chun.

• Mechanical Engineering.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/69490

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/69490