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Showing 1 to 20 of 141 for “"CMP"”.

  1. The environmental impact of copper CMP

    Thesis (M.Eng.)--Massachusetts Institute of Technology, Dept. of Civil and Environmental Engineering, 2000.

    mit Repository record for The environmental impact of copper CMP (opens in a new tab)

  2. Möglichkeiten eines DMO-Prozesses in der CMP-Refraktionsseismik

    Die herk¨ommlichen Wellenfeldbearbeitungen der CMP-Refraktionsseismik basieren auf N¨aherungsl¨osungen f¨ur kleine Schichtneigungen. Dieser Ansatz hat sich f¨ur Schichtneigungswinkel bis zu ca. 100 bew¨ahrt. Mit gr¨oßer werdendem Neigungswinkel verschlechtern sich die Ergebnisse der …

    lmu-germany Repository record for Möglichkeiten eines DMO-Prozesses in der CMP-Refraktionsseismik (opens in a new tab)

  3. Copper Surface Chemistry Relevant to Chemical Mechanical Planarization (Cmp)

    … (TAZ) on copper removal rate during CMP. Removal rates were higher for solutions containing TAZ than solutions containing BTA. The corrosion inhibitor films were characterized using AFM, cyclic voltammetry, impedance spectroscopy, surface-enhanced Raman spectroscopy, and mass …

    uiuc Repository record for Copper Surface Chemistry Relevant to Chemical Mechanical Planarization (Cmp) (opens in a new tab)

  4. Metrology of SIMOX buried oxide and nitride/STI CMP

    … Isolation (STI) Chemical Mechanical Polishing (CMP). CMP processes have been heralded as a way to planarize films and structures on wafers to a degree which has not been possible before. However, recent studies have shown that the uniformity of CMP processes depends on the layout-pattern …

    mit Repository record for Metrology of SIMOX buried oxide and nitride/STI CMP (opens in a new tab)

  5. Ice and abrasive particles : an alternative CMP polishing technique

    Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1998.

    mit Repository record for Ice and abrasive particles : an alternative CMP polishing technique (opens in a new tab)

  6. Framework for characterization of copper interconnect in damascene CMP processes

    Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science; and, Thesis (B.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1998.

    mit Repository record for Framework for characterization of copper interconnect in damascene CMP processes (opens in a new tab)

  7. Kazuistika fyzioterapeutické péče o pacienta po ischemické CMP s pravostrannou hemiparézou

    … fyzioterapeutické péče o pacienta po ischemické CMP s pravostrannou hemiparézou Cíl práce: Získání a zpracování teoretických poznatků o etiologii, klinických příznacích, stádiích a možných variantách onemocnění a následných terapeutických přístupech u cévní mozkové příhody. Dále prokázání …

    charles-prague Repository record for Kazuistika fyzioterapeutické péče o pacienta po ischemické CMP s pravostrannou hemiparézou (opens in a new tab)

  8. Exploiting Multigrain Parallelism in Pairwise Sequence Search on Emergent CMP Architectures

    With the emerging hybrid multi-core and many-core compute platforms delivering unprecedented high performance within a single chip, and making rapid strides toward the commodity processor market, they are widely expected to replace the multi-core processors in the existing High-Performance …

    vt Repository record for Exploiting Multigrain Parallelism in Pairwise Sequence Search on Emergent CMP Architectures (opens in a new tab)

  9. Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP)

    … instability in chemical-mechanical polishing (CMP) slurries. In CMP, the formation of large agglomerates is of great concern, as these large particles are associated with high defectivity and poor polishing performance. The proposed model describes the complex CMP slurry system as a colloid …

    mit Repository record for Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP) (opens in a new tab)

  10. A statistical metrology framework for characterizing ILD thickness variation in CMP processes

    Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1996.

    mit Repository record for A statistical metrology framework for characterizing ILD thickness variation in CMP processes (opens in a new tab)

  11. Improving the Off-chip Bandwidth Utilization and Energy Efficiency in Chip Multiprocessor (CMP) Architectures

    … and energy efficiency in chip multiprocessor (CMP) architectures. This work consists of two main parts. The first part investigates the early write-back technique for a two-level cache hierarchy in a CMP with four processor cores. Early write-back can be viewed as a modified cache write policy …

    siu-theses Repository record for Improving the Off-chip Bandwidth Utilization and Energy Efficiency in Chip Multiprocessor (CMP) Architectures (opens in a new tab)

  12. Using statistical metrology to understand pattern-dependent ILD thickness variation in oxide CMP processes

    Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1997.

    mit Repository record for Using statistical metrology to understand pattern-dependent ILD thickness variation in oxide CMP processes (opens in a new tab)

  13. Proteindesign zur Verbesserung des Nucleosidanaloga-Umsatzes in menschlichen Zellen: Desoxycytidin-Kinase und UMP/CMP-Kinase

    … Desoxycytidin-Kinase (dCK) und die UMP/CMP-Kinase kloniert, überexprimiert und aufgereinigt. Da neben der Phosphorylierung durch Kinasen auch die Inaktivierung der Nucleosidanaloga durch Desaminasen eine wichtige Rolle spielt, wurden die menschliche Cytidin- und die …

    goettingen Repository record for Proteindesign zur Verbesserung des Nucleosidanaloga-Umsatzes in menschlichen Zellen: Desoxycytidin-Kinase und UMP/CMP-Kinase (opens in a new tab)

  14. Phylogenetic distribution of CMP-Neu5Ac hydroxylase (CMAH), the enzyme synthetizing the pro-inflammatory human xeno-antigen Neu5Gc

    The enzyme CMP-N-acetylneuraminic acid hydroxylase (CMAH) is responsible for thesynthesis of N-glycolylneuraminic acid (Neu5Gc), a sialic acid present on the cell surfaceproteins of most deuterostomes. The CMAH gene is thought to be present in mostdeuterostomes, but it has been inactivated in a …

    unr Repository record for Phylogenetic distribution of CMP-Neu5Ac hydroxylase (CMAH), the enzyme synthetizing the pro-inflammatory human xeno-antigen Neu5Gc (opens in a new tab)

  15. Modeling of advanced integrated circuit planarization processes : electrochemical-mechanical planarization (eCMP), STI CMP using non-conventional slurries

    … copper planarization (eCMP) are developed, with a focus on electrochemical mechanisms and wafer-scale uniformity. Specifically, previous models for eCMP are enhanced to consider the full electrochemical system driving planarization in eCMP. We explore the notion of …

    mit Repository record for Modeling of advanced integrated circuit planarization processes : electrochemical-mechanical planarization (eCMP), STI CMP using non-conventional slurries (opens in a new tab)

  16. Applying run-by-run process control to chemical-mechanical planarization and assessing insertion costs versus benefits of CMP

    Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1995, and Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1995.

    mit Repository record for Applying run-by-run process control to chemical-mechanical planarization and assessing insertion costs versus benefits of CMP (opens in a new tab)

  17. Characterization and modeling of polysilicon MEMS chemical-mechanical polishing

    … circuits, chemical-mechanical polishing (CMP) is becoming an enabling technology for microelectromechanical systems (MEMS). To reliably use CMP in the manufacturing process, designers must be able to accurately predict the CMP process and control final surface uniformity. This thesis …

    mit Repository record for Characterization and modeling of polysilicon MEMS chemical-mechanical polishing (opens in a new tab)

  18. The association between musculoskeletal pain and physical activity, falls and psychological concerns related to falls in community dwelling older adults

    Background Chronic musculoskeletal pain (CMP) is a common pervasive issue among older adults and may affect mobility and falls risk. Aims Investigate the relationship between CMP and physical activity/ sedentary behaviour, psychological concerns related to falls and falls in community dwelling …

    greenwich Repository record for The association between musculoskeletal pain and physical activity, falls and psychological concerns related to falls in community dwelling older adults (opens in a new tab)

  19. Emergent quality issues in the supply of Chinese medicinal plants: A mixed methods investigation of their contemporary occurrence and historical persistence

    … centuries ago in Chinese medicinal plants (CMP) were investigated to explore why they still persist in an era of advanced analytical testing and extensive legislation so that a solution to improve CMP quality could be proposed. This is important for 85% of the world’s population who rely on …

    westminster Repository record for Emergent quality issues in the supply of Chinese medicinal plants: A mixed methods investigation of their contemporary occurrence and historical persistence (opens in a new tab)

  20. Chip-scale modeling of pattern dependencies in copper chemical mechanical polishing processes

    Chemical mechanical polishing (CMP) has become a necessary processing step in the fabrication of copper interconnects. Copper CMP is recognized to suffer from pattern dependent problems such as dishing and erosion, which cause increased line resistance and non-uniformity within the die. The …

    mit Repository record for Chip-scale modeling of pattern dependencies in copper chemical mechanical polishing processes (opens in a new tab)

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