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University of North Texas

Electrodeposition of Copper on Ruthenium Oxides and Bimetallic Corrosion of Copper/Ruthenium in Polyphenolic Antioxidants

Abstract

dc:description

Copper (Cu) electrodeposition on ruthenium (Ru) oxides was studied due to important implications in semiconductor industry. Ruthenium, proposed as the copper diffusion barrier/liner material, has higher oxygen affinity to form different oxides. Three different oxides (the native oxide, reversible oxide, and irreversible oxide) were studied. Native oxide can be formed on exposing Ru in atmosphere. The reversible and irreversible oxides can be formed by applying electrochemical potential. Investigation of Cu under potential deposition on these oxides indicates the similarity between native and reversible oxides by its nature of inhibiting Cu deposition. Irreversible oxide formed on Ru surface is rather conductive and interfacial binding between Cu and Ru is greatly enhanced. After deposition, bimetallic corrosion of Cu/Ru in different polyphenols was studied. Polyphenols are widely used as antioxidants in post chemical mechanical planarization (CMP). For this purpose, different trihydroxyl substituted benzenes were used as antioxidants. Ru, with its noble nature enhances bimetallic corrosion of Cu. Gallic acid (3,4,5 - trihydroxybenzoic acid) was chosen as model compound. A mechanism has been proposed and validity of the mechanism was checked with other antioxidants. Results show that understanding the chemical structure of antioxidants is necessary during its course of reaction with Cu.

Degree

thesis:*
Grantor dc:publisher
University of North Texas
Year dc:date
2007

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Venkataraman, Shyam S.
Contributors dc:contributor
  • Chyan, Oliver M. R.
  • Verbeck, Guido F.

Subjects

dc:subject × 12

Rights

dc:rights
Statement dc:rights
  • Public
  • Copyright
  • Venkataraman, Shyam S.
  • Copyright is held by the author, unless otherwise noted. All rights reserved.
Language dc:language
English

Identifiers

dc:identifier.*
Identifier
oclc: 191700258
https://digital.library.unt.edu/ark:/67531/metadc3908/
ark: ark:/67531/metadc3908
OAI identifier oai:identifier
info:ark/67531/metadc3908

Chain of custody

source
Harvested from
University of North Texas
Base URL
digital.library.unt.edu/oai/
Last updated
2026-07-24
Source record
OAI-PMH GetRecord
citation

Venkataraman, Shyam S.. Electrodeposition of Copper on Ruthenium Oxides and Bimetallic Corrosion of Copper/Ruthenium in Polyphenolic Antioxidants. University of North Texas, 2007. https://doi.org/10.12794/metadc3908