ENHANCEMENT OF SATURATION BOILING OF PF-5060 DIELECTRIC LIQUID ON MICROPOROUS SURFACES

This research experimentally investigated microporous Copper (MPC) surfaces for enhancing nucleate boiling and increasing the Critical Heat Flux (CHF) of PF-5060 dielectric liquid and the potential application of the results to immersion cooling of high power computer chips. MPC surfaces of different thicknesses (80—230 \uf06dm), fabricated using conventional electrochemical deposition at high current density, have different morphology and microstructure. The PF-5060 liquid is chemically inert, environmentally friendly, and has low enough saturation temperature (~ 54oC at 0.10 MPa). This helps maintain the chip junctions temperature below that recommended by the chip manufacturer (85-120 oC, depending on the application).'

Name thesis:degree_name

Mechanical Engineering

Level thesis:degree_level

Doctoral

Discipline thesis:degree_discipline

Mechanical Engineering

Year

2014

Author dc:creator

• Amir, Ali

Contributors dc:contributor

• El-Genk, Mohamed
• Ward, Timothy
• Heinrich, Juan
• Leseman, Zayd

• Boiling Enhancement
• Two phase heat transfer
• Microporous coating

Language dc:language

English

Identifier

https://digitalrepository.unm.edu/me_etds/20

OAI identifier oai:identifier

oai:digitalrepository.unm.edu:me_etds-1019