{"id":{"repo_id":"unm","oai_identifier":"oai:digitalrepository.unm.edu:me_etds-1019"},"canonical_url":"https://search.dev.ndltd.org/etd/unm/oai:digitalrepository.unm.edu:me_etds-1019","repository":{"repo_id":"unm","name":"University of New Mexico","base_url":"https://digitalrepository.unm.edu/do/oai/"},"display":{"title":"ENHANCEMENT OF SATURATION BOILING OF PF-5060 DIELECTRIC LIQUID ON MICROPOROUS SURFACES","abstract":"This research experimentally investigated microporous Copper (MPC) surfaces for enhancing nucleate boiling and increasing the Critical Heat Flux (CHF) of PF-5060 dielectric liquid and the potential application of the results to immersion cooling of high power computer chips. MPC surfaces of different thicknesses (80—230 \\uf06dm), fabricated using conventional electrochemical deposition at high current density, have different morphology and microstructure. The PF-5060 liquid is chemically inert, environmentally friendly, and has low enough saturation temperature (~ 54oC at 0.10 MPa). This helps maintain the chip junctions temperature below that recommended by the chip manufacturer (85-120 oC, depending on the application).'","abstract_html":"This research experimentally investigated microporous Copper (MPC) surfaces for enhancing nucleate boiling and increasing the Critical Heat Flux (CHF) of PF-5060 dielectric liquid and the potential application of the results to immersion cooling of high power computer chips. MPC surfaces of different thicknesses (80—230 \\uf06dm), fabricated using conventional electrochemical deposition at high current density, have different morphology and microstructure. The PF-5060 liquid is chemically inert, environmentally friendly, and has low enough saturation temperature (~ 54oC at 0.10 MPa). This helps maintain the chip junctions temperature below that recommended by the chip manufacturer (85-120 oC, depending on the application).'","abstract_has_math":false,"creators":["Amir, Ali"],"institution":null,"degree_name":"Mechanical Engineering","degree_level":"Doctoral","degree_discipline":"Mechanical Engineering","degree_department":null,"school":null,"contributors":["El-Genk, Mohamed","Ward, Timothy","Heinrich, Juan","Leseman, Zayd"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2014,"date_issued":"2014-02-13T08:00:00Z","date_published":"2014-02-13T08:00:00Z","updated_at":"2026-07-24T05:27:04Z","subjects":["Boiling Enhancement","Two phase heat transfer","Microporous coating"],"languages":["English"],"rights":[],"rights_urls":[],"identifier_entries":[{"key":"dc:identifier","label":"Identifier","values":["https://digitalrepository.unm.edu/me_etds/20"],"render_values":[{"text":"https://digitalrepository.unm.edu/me_etds/20","href":"https://digitalrepository.unm.edu/me_etds/20","code":true}]}]},"links":{"outbound_url":"http://hdl.handle.net/1928/23530","outbound_label":"Handle","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["El-Genk, Mohamed","Ward, Timothy","Heinrich, Juan","Leseman, Zayd"]},{"key":"dc:creator","label":"Author","values":["Amir, Ali"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"thesis:degree_discipline","label":"Discipline","values":["Mechanical Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Doctoral","Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Mechanical Engineering"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Boiling Enhancement","Two phase heat transfer","Microporous coating"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language","label":"Dc Language","values":["English"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["http://hdl.handle.net/1928/23530","https://digitalrepository.unm.edu/me_etds/20"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description.abstract","label":"Abstract","values":["This research experimentally investigated microporous Copper (MPC) surfaces for enhancing nucleate boiling and increasing the Critical Heat Flux (CHF) of PF-5060 dielectric liquid and the potential application of the results to immersion cooling of high power computer chips. MPC surfaces of different thicknesses (80—230 \\uf06dm), fabricated using conventional electrochemical deposition at high current density, have different morphology and microstructure. The PF-5060 liquid is chemically inert, environmentally friendly, and has low enough saturation temperature (~ 54oC at 0.10 MPa). This helps maintain the chip junctions temperature below that recommended by the chip manufacturer (85-120 oC, depending on the application).'"]},{"key":"dc:title","label":"Title","values":["ENHANCEMENT OF SATURATION BOILING OF PF-5060 DIELECTRIC LIQUID ON MICROPOROUS SURFACES"]}]}],"canonical_facts":{"dc:contributor":["El-Genk, Mohamed","Ward, Timothy","Heinrich, Juan","Leseman, Zayd"],"dc:creator":["Amir, Ali"],"dc:description.abstract":["This research experimentally investigated microporous Copper (MPC) surfaces for enhancing nucleate boiling and increasing the Critical Heat Flux (CHF) of PF-5060 dielectric liquid and the potential application of the results to immersion cooling of high power computer chips. MPC surfaces of different thicknesses (80—230 \\uf06dm), fabricated using conventional electrochemical deposition at high current density, have different morphology and microstructure. The PF-5060 liquid is chemically inert, environmentally friendly, and has low enough saturation temperature (~ 54oC at 0.10 MPa). This helps maintain the chip junctions temperature below that recommended by the chip manufacturer (85-120 oC, depending on the application).'"],"dc:identifier":["http://hdl.handle.net/1928/23530","https://digitalrepository.unm.edu/me_etds/20"],"dc:language":["English"],"dc:subject":["Boiling Enhancement","Two phase heat transfer","Microporous coating"],"dc:title":["ENHANCEMENT OF SATURATION BOILING OF PF-5060 DIELECTRIC LIQUID ON MICROPOROUS SURFACES"],"thesis:degree_discipline":["Mechanical Engineering"],"thesis:degree_level":["Doctoral","Dissertation"],"thesis:degree_name":["Mechanical Engineering"]},"updated_at":"2026-07-24T05:27:04Z"}