Measurements and Modeling of Ti and TiN Sputtering

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Name thesis:degree_name

M.S. (master's)

Level thesis:degree_level

Thesis

Discipline thesis:degree_discipline

Nuclear, Plasma, and Radiological Engineering

Year dc:date

2017

Author dc:creator

• Ranjan, Rajiv

• nuclear engineering
• ti sputtering
• tin sputtering
• diffusion
• barrier
• layers
• Al
• Cu
• metallization
• physical vapor depostion
• pvd
• ion surface interaction experiement
• IIAX

Statement dc:rights

• Copyright 2000 Rajiv Ranjan

Language dc:language

en

Handle dc:identifier

http://hdl.handle.net/2142/96508

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/96508