Local Displacements and Load Transfer of Shape Memory Alloys in Polymeric Matrices

Average interfacial bond strength between an embedded SMA and an epoxy matrix were measured using pullout tests. The effects of various mechanical and chemical surface treatments on the bond strengths were examined. In-situ out-of-plane displacements of two-way trained SMA wires in epoxy were measured using heterodyne microinterferometry. The interfacial bond strengths from the pullout tests were correlated with the maximum wire displacements. The transient load transfer behavior of a one-way SMA ribbon in a room temperature cured polymer matrix was quantified using two-dimensional photoelasticity. The effects of residual stress were examined using high temperature cured matrices. In-plane displacements of room temperature cured SMA ribbon composites were obtained using moire interferometry. Displacements due to thermal expansion were separated from displacements due to SMA actuation. An experimental value for the velocity of propagation of the SMA actuation front was calculated. A finite element model based on one-dimensional constitutive equations was developed for ribbon composites. Displacements and stresses in the ribbon were compared with experimental values.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Theoretical and Applied Mechanics

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2015

Author dc:creator

• Jonnalagadda, Krishna D.

Contributors dc:contributor

• Sottos, Nancy R.

• Engineering, Mechanical

Language dc:language

eng

Identifier

(MiAaPQ)AAI9812644

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/87767