Thin -Film Adhesion Measurement by Laser -Induced Stress Waves

Based on the theoretical and experimental parametric study results, the planar tensile sample geometry is modified to a triangular prism so that a high strain rate shear wave is generated and then allowed to impinge upon the test film. By allowing the initial longitudinal wave to mode convert to a shear wave and a secondary longitudinal wave at the oblique surface, mixed-mode loading of the thin film interface is realized. Film failure under mixed-mode conditions is observed and the mixed-mode interfacial strength is measured and compared with the tensile case.

Name thesis:degree_name

Ph.D.

Level thesis:degree_level

Dissertation

Discipline thesis:degree_discipline

Theoretical and Applied Mechanics

Grantor

University of Illinois at Urbana-Champaign

Year dc:date

2015

Author dc:creator

• Wang, Junlan

Contributors dc:contributor

• Sottos, Nancy R.
• Weaver, Richard L.

• Engineering, Materials Science

Language dc:language

eng

Identifier

(MiAaPQ)AAI3070468

OAI identifier oai:identifier

oai:www.ideals.illinois.edu:2142/87710